Global IC-Substrate Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global IC-Substrate Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

IC Substrate is a load-bearing component in the chip packaging process, which contains circuits inside to provide electrical connection between the chip and the conventional PCB.

Market Overview:

The latest research study on the global IC-Substrate market finds that the global IC-Substrate market reached a value of USD 8380.96 million in 2022. It’s expected that the market will achieve USD 12801.78 million by 2028, exhibiting a CAGR of 7.32% during the forecast period.

In the first half of 2020, affected by the global coronavirus epidemic and increased trade frictions, the global economic growth rate continued to decline, and the real economy suffered a huge impact. The impact of COVID-19 on the IC substrate industry will involve all entities in the industry chain. The downstream market demand fluctuates, and the overall demand of the PCB industry has declined. The company’s management efficiency has declined, commuting has been severely hampered, production plans have been severely hampered, network expansion has been delayed, marketing has been delayed, market sales have fallen, and company and employee income has fallen. Among them, the coronavirus epidemic in China was the first to be brought under control, and the factory was also the fastest to recover, so the overall negative impact was relatively small. However, the fermentation of the epidemic in Japan and South Korea may affect production capacity, resulting in a decline in the income of market participants in the industry.

Strength

As the carrier of chips, IC substrates have been increasing in market applications.
Higher precision and density drive advanced integrated packaging technology.
The trend of miniaturization of semiconductor devices.

Weakness

The risk of raw material price fluctuations.
The packaging substrate production process is complicated, the equipment-specific type is high, and the capital investment is high.

Opportunities

Rapid development at both ends of production and demand in developing countries.
The development of 5G and Internet of Things technology will promote the rapid development of the semiconductor industry chain.

Threat

Risks from macroeconomic fluctuations.
Trade frictions and the coronavirus epidemic pose major challenges to the global political and economic situation and industrial structure.

Region Overview:

From 2023-2028, Asia Pacific is estimated to witness robust growth prospects.

Company Overview:

Unimicron is one of the major players operating in the IC-Substrate market, holding a share of 13.12% in 2023.

Unimicron

Unimicron is mainly engaged in the production and sales of printed circuit boards and IC burn-in test foundry. Its product projects include rigid PCB, flexible PCB, HDI boards, IC substrates, etc.

Semco

Samsung Electro-Mechanics Co., Ltd. manufactures a variety of electronic components used in computers, audio and video products, industrial electronics, and telecommunication equipment. The Company's products include multi-layer boards and capacitors, optical Pick Ups, deflection yokes (DY), keyboards, speakers, and light emitting diode (LED) products.

Segmentation Overview:

By type, FC BGA Substrate segment accounted for the largest share of market in 2022.

Application Overview:

By application, the PC (Tablet, Laptop) segment occupied the biggest share from 2018 to 2022.

Key Companies in the global IC-Substrate market covered in Chapter 3:

Shinko
Shennan Circuit
Kinsus
Ibiden
Toppan
Simmtech
Semco
Unimicron
Shenzhen Fastprint Circuit Tech
Nan Ya PCB Corporation
LG Innotek
ACCESS
AT&S
TTM Technologies
Zhen Ding Technology
Kyocera
ASE
Daeduck
Korea Circuit

In Chapter 4 and Chapter 14.2, on the basis of types, the IC-Substrate market from 2018 to 2029 is primarily split into:

WB BGA Substrate
WB CSP Substrate
FC BGA Substrate
FC CSP Substrate
Other Types

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the IC-Substrate market from 2018 to 2029 covers:

PC (Tablet, Laptop)
Smart Phone
Wearable Devices and Entertainment Equipment
Other Applications

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)