Global IC Lead Frames Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029
IC lead frame used in integrated circuit is a main structural material in integrated circuit package. In the circuit, it mainly plays the role of bearing IC chip, connecting the chip with the external circuit board's electrical signal, and the mechanical role of installation and fixation.
Market Overview:The latest research study on the global IC Lead Frames market finds that the global IC Lead Frames market reached a value of USD 3338.36 million in 2022. It’s expected that the market will achieve USD 4503.56 million by 2028, exhibiting a CAGR of 5.12% during the forecast period.
Region Overview:From 2023-2028, China is estimated to witness robust growth prospects.
Company Overview:Mitsui High-tec is one of the major players operating in the IC Lead Frames market, holding a share of 15.97% in 2022.
Mitsui High-tec, Inc. engages in the production and sale of lead frame, motor core, precision tooling and machine tools. It operates through the following segments: Metal Molds, Electronic Components, Electrical Components, and Machine Tools. The Metal Molds segment manufactures and sells molds for press. The Electronic Components segment engages in the manufacture and sale of IC (Integrated Circuit) assembly and lead frame products. The Electrical Components segment handles the production of motor cores. The Machine Tools segment produces precision surface grinders.
Haesung DS has been a global leader in the semiconductor market since its establishment. Haesung DS business consists of lead frame and PKG substrates. Also most of Haesung DS products are exported to global semiconductor customers.
Segmentation Overview:Among different product types, Stamping Process segment is anticipated to contribute the largest market share in 2028.
Application Overview:By application, the Consumer Electronics segment occupied the biggest share from 2018 to 2022.
Key Companies in the global IC Lead Frames market covered in Chapter 3:Shinko
Fusheng Electronics
Kangqiang
HAESUNG DS
Mitsui High-tec
Chang Wah Technology
POSSEHL
I-Chiun
SDI
Enomoto
Hualong
DNP
AAMI (ASM)
JIH LIN TECHNOLOGY
In Chapter 4 and Chapter 14.2, on the basis of types, the IC Lead Frames market from 2018 to 2029 is primarily split into:Stamping Process
Etching Process
In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the IC Lead Frames market from 2018 to 2029 covers:Consumer Electronics
Communications and Telecom
Automotive
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)