Global Hybrid Memory Cube (HMC) And High Bandwidth Memory (HBM) Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global Hybrid Memory Cube (HMC) And High Bandwidth Memory (HBM) Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

The Hybrid Memory Cube (HMC) is the high-performance RAM interface through-silicon via (TSV) technology by connecting the multiple memory arrays to the top of one another. It uses standard DRAM cells for memory implementation. The High-bandwidth Memory (HBM) is also the RAM interface but for 3D stacked SDRAM. It is used in combination with network devices and graphic accelerators. Both memory bus is capable of providing the higher bandwidth with lower power consumption. It is widely applicable in graphics designing, in the field of networking, and others. HMC and HBM are appropriate for Big Data applications since they offer super quick stockpiling execution. These advancements additionally adequately address the presentation, transfer speed, and perseverance necessities of Big Data applications.

Market Overview:

The latest research study on the global Hybrid Memory Cube (HMC) And High Bandwidth Memory (HBM) market finds that the global Hybrid Memory Cube (HMC) And High Bandwidth Memory (HBM) market reached a value of USD 1315.62 million in 2022. It’s expected that the market will achieve USD 3787.19 million by 2028, exhibiting a CAGR of 19.27% during the forecast period.

Rising adoption of artificial intelligence (AI)

Rising adoption of artificial intelligence (AI), broadly referring to the intelligence displayed by machines contrary to the natural intelligence demonstrated by humans, across various facets of technology applications is building momentum form high-tech memory devices. AI adoption is soaring on an ongoing basis amid escalating computational capacity in the 'Cloud', and improvements in sophisticated algorithms, while generating parallel opportunities to advanced hardware devices including high-performing memory and processors. Electronic device miniaturization is another major growth driver for HMC/HBM technology. As MEMS devices are small, they require advanced memory solutions made in extremely low-footprint designs, but with higher memory capacities, for which HMC/HBM can offer potential alternative. HMC and HBM market also stands to gain from high growth momentum in stacked DRAM vertical, gauged through wider uptake of 3D TSV technology in DRAM fabrication. Leading DRAM memory vendors are prioritizing 3D layer stacking with TSV technology to develop high-quality memory devices to address the growing high-performance computing needs of consumers, while creating ample space for HMC and HBM, the stacked DRAM memory solutions.

Fluctuations in raw material prices

Fluctuations in the price, availability and quality of the commodities, raw materials and components used in manufacturing Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) products could have an adverse effect on costs of sales, profitability and the ability to meet customers' demand. The price of commodities, raw materials and components have been volatile in prior years, and the cost, quality and availability of such commodities have been significantly affected in recent years by, among other things, changes in global supply and demand, changes in laws and regulations (including tariffs and duties), changes in exchange rates and worldwide price levels, natural disasters, labor disputes, terrorism and political unrest or instability. These factors could lead to further price increases or supply interruptions in the future. As discussed above, in the short term, rapid changes in raw material costs can be very difficult for manufactures to offset with price increases because, in the case of many of contracts, suppliers have committed to selling prices for goods and services for periods of one year, and occasionally longer. Manufactures' profit margins could be adversely affected if commodity, raw material and component costs remain high or escalate further, and, manufactures are unable to pass along a portion of the higher costs to customers. Price variance caused by fluctuations in raw material prices, which is not conducive to the development of the industry.

Region Overview:


Geographically, North America held the largest market share-42.98% in 2022.


Company Overview:

Samsung is one of the major players operating in the Hybrid Memory Cube (HMC) And High Bandwidth Memory (HBM) market, holding a share of 54.15% in 2022.

Samsung

The Samsung Group is a South Korean multinational manufacturing conglomerate headquartered in Samsung Town, Seoul, South Korea. Samsung promises cutting-edge components services, TCO solutions and technical services with the widest product portfolio in the industry and adds value through the flexibility to collaborate with customers and partners, leveraging resources throughout the product development process.

ADM and SK Hynix

Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. SK hynix Inc. is a South Korean memory semiconductor supplier of dynamic random-access memory (DRAM) chips and flash memory chips. Advanced Micro Devices is currently the only company to use high-bandwidth memory it co-developed with SK Hynix and other partners.

Segmentation Overview:

By type, High-bandwidth memory (HBM) segment accounted for the largest share of market in 2022.

Hybrid Memory Cube (HMC)

A high-performance RAM interface for TSV-based stacked DRAM memory, HMC dramatically enhances the performance of conventional memory to a new level, while substantially reducing the power consumption and costs. HMC can deliver 15 times higher performance as compared to a DDR3 module, while consuming 70% less per bit energy. Other key attributes of HMC include high per bit density and decreased form factor that drastically enhances total memory space. HMC device typically requires 90% less space than the presently available RDIMMs. With its highly innovative performance attributes, HMC can offer a resourceful platform that augments network system performance to new 100G and higher infrastructure, while keeping up with advancements in CPUs and GPUs. The use of HMC DRAM memory is currently being contemplated in applications such as graphic cards, data center infrastructure and high-performance computing applications seeking bandwidth, form factor and energy efficiencies.

High-bandwidth memory (HBM)

Similarly, High Bandwidth Memory (HBM) is a high-performance RAM interface for 3D-stacked DRAM memory. Made in a revolutionary vertically stacked configuration enabled by TSV technology, HBM extends much improved performance benefits as compared to conventional DRAM solutions. Key benefits of the HBM technology include vastly improved memory bandwidth, drastically reduced memory subsystem power, and smaller footprint, all of which potentially trigger large-scale, industry-wide innovation in DRAM memory vertical. HBM makes use of TSV technology and microbumps for interconnecting base die and DRAM die to build 1GB DRAM density per device. The model potentially brings new level of efficiency in CPUs, GPUs, FPGAs, and ASICs.

Application Overview:

The market's largest segment by application is the segment Graphics, with a market share of 41.69% in 2022.

Based on Application, the market is segmented into Graphics, High-performance Computing, Networking, Data Centers. It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs and FPGAs and in some supercomputers (such as the NEC SX-Aurora TSUBASA and Fujitsu A64FX).

Key Companies in the global Hybrid Memory Cube (HMC) And High Bandwidth Memory (HBM) market covered in Chapter 3:

AMD and SK Hynix
Samsung
Micron

In Chapter 4 and Chapter 14.2, on the basis of types, the Hybrid Memory Cube (HMC) And High Bandwidth Memory (HBM) market from 2018 to 2029 is primarily split into:

Hybrid Memory Cube (HMC)
High-bandwidth memory (HBM)

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Hybrid Memory Cube (HMC) And High Bandwidth Memory (HBM) market from 2018 to 2029 covers:

Graphics
High-performance Computing
Networking
Data Centers

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)