Global Epoxy Molding Compounds Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029
Market Overview:
The latest research study on the global Epoxy Molding Compounds market finds that the global Epoxy Molding Compounds market reached a value of USD 1807.11 million in 2022. It’s expected that the market will achieve USD 3807.1 million by 2028, exhibiting a CAGR of 13.22% during the forecast period.
Upgrades to consumer electronics devices are driving market size
The complexity and diversification of mobile phone functions and the popularization of 5G communication technology drive the demand for consumer electronic components to increase. Due to the loading of new application modules such as multi-camera module, 3D sensor, wireless charging, off-screen fingerprint, etc., more passive components are needed in the mobile phone to stabilize voltage, filter and current, so as to ensure the stable operation of the equipment. Wearable devices usually need to be equipped with motion sensors, biosensors, environmental sensors, etc., and there is a great demand for electronic components with sensing functions. As an important part of the production of consumer electronic components, electronic component packaging will promote the continuous growth of epoxy molding compounds market in the future.
Technical and talent challenges
With the continuous improvement of technology and environmental protection requirements in the electronic components industry, the epoxy molding compounds that provide supporting services must be constantly updated to meet the needs of new customers. The electronic components industry has high reliability requirements and strict requirements for product stability. Excellent R&D teams are needed to ensure the continuous research and development ability and independent innovation ability of enterprises. In addition, several key processes in the production of epoxy molding compounds have high requirements for technical personnel, whose experience and process ability play an important role in the quality characteristics of the final product. It is difficult for small enterprises to organize production normally and stably due to lack of research and development personnel and technicians who master key technology.
Region Overview:Asia Pacific dominated the Epoxy Molding Compounds market in 2022, with a market share of 74.34%.
Company Overview:Sumitomo Bakelite is one of the major players operating in the Epoxy Molding Compounds market, holding a share of 20.63% in 2023.
Sumitomo Bakelite
Sumitomo Bakelite Company Limited is an integrated processor of synthetic resins and a member of the Sumitomo Chemical Group. The Company's products are used in production of electronic components such as semiconductors and circuit boards, and industrial products such as automobiles.
Hitachi Chemical
Hitachi Chemical Co Ltd manufactures and sells a variety of electronic materials, plastic polymers, automotive products, and other chemical-related products.
Segmentation Overview:By type, Pellet segment accounted for the largest share of market in 2022.
Application Overview:The market's largest segment by application is the segment OSAT, with a market share of 45.81% in 2022.
Key Companies in the global Epoxy Molding Compounds market covered in Chapter 3:Hysol Huawei Electronics
Shin-Etsu Chemical
Panasonic
Hitachi Chemical
Samsung SDI
KCC
NAGASE
HHCK
Tianjin Kaihua Insulating Material
Eternal Materials
Sumitomo Bakelite
Jiangsu zhongpeng new material
Chang Chun Group
In Chapter 4 and Chapter 14.2, on the basis of types, the Epoxy Molding Compounds market from 2018 to 2029 is primarily split into:Liquid
Granule
Pellet
Film
In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Epoxy Molding Compounds market from 2018 to 2029 covers:OSAT
IDM
Electronic Device
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)