Global Electronic Printed Circuit Board (PCB) Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global Electronic Printed Circuit Board (PCB) Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.

Market Overview:

The latest research study on the global Electronic Printed Circuit Board (PCB) market finds that the global Electronic Printed Circuit Board (PCB) market reached a value of USD 71009.0 million in 2022. It’s expected that the market will achieve USD 85630.0 million by 2028, exhibiting a CAGR of 3.17% during the forecast period.

Development of smartphones and automotive electronics industry

With the development of smart phones and the automotive electronics industry, global PCB production has grown steadily: the global PCB industry has entered a period of steady growth, and the search for new growth points is the industry's development trend. In the downstream applications of PCBs, smartphones and cars will be the main drivers of growth in the industry.

Complex production process

The PCB industry has many types of products, many kinds of raw materials, long production processes, and many processes. Enterprises must have strong management capabilities to ensure their own normal operations. At the same time, although various PCB products have some common basic processes, it is more important to determine the difference according to the thickness and material of the substrate, the accuracy of the line width and line spacing, the design structure and production scale, and other special requirements specified by the customer. The production process and equipment are highly customized. Due to the precision of the downstream electronic products and the characteristics of the production mode, the PCB quality is unstable or the delivery is not timely, which will affect the customer's confidence in the product to a large extent.

Upgrade of communication technology

5G is the focus of the future development of the mobile communications industry, and communication equipment manufacturers and telecom operators have begun to lay out next-generation communication technologies without exception. 5G communication will have faster speed than 4G, and upgrade the communication speed and capacity. The technology is mainly embodied in millimeter wave, small base station, Massive MIMO technology and so on. Due to the application of the above technologies, the communication equipment of the 5G era has higher requirements for communication materials, and the demand is also larger, which brings broad prospects for the future development of high-frequency PCB/CCL.

Region Overview:

Geographically, China held the largest market share – 52.97% in 2022.

Company Overview:

Zhen Ding Technology Holding Limited (ZDT) is one of the major players operating in the Electronic Printed Circuit Board (PCB) market, holding a share of 6.52% in 2021.

Zhen Ding Technology Holding Limited (ZDT)

Zhen Ding Technology Holding Limited manufactures printed circuit boards. The Company produces and sells high density interconnection, flexible printed circuit, rigid printed circuit board, and other products. Zhen Ding Technology Holding markets its products throughout China.

NOK Corporation

NOK is Japan’s longest established oil seal manufacturer. Our functional parts such as oil seals and mechanical seals, created through advanced seal technology, are not only employed in the automotive industry but are also used in a wide range of other industries. They have developed into the leading company in the field in terms of reliability by leveraging the technology and know-how we have accumulated since the start of operations.

Segmentation Overview:

By type, Standard multilayer segment accounted for the largest share of market in 2022.

Rigid 1-2 sided

Rigid 1-2 faces are divided into single panels, double panels. The most basic printed circuit board of a single panel, with one part on one side and the other side on the other side. The double panel is a printed circuit board that prints conductive patterns on both sides of a double-sided copper clad plate.

Standard multilayer

The multi-layer board refers to a printed circuit board having four or more layers of conductive patterns. The inner layer is formed by laminating a conductive pattern and an insulating slab, and the outer layer is a copper foil, which is pressed into a whole.

High-Density Interconnect (HDI)

High-density interconnectors (HDI, high-density interconnected circuit boards) are boards with relatively high line-distribution density using micro-bump buried via technology.

Flexible circuits

Flexible Printed Circuit (FPC) is the only solution to meet the miniaturization and movement requirements of electronic products. It can be bent, wound and folded freely.

Package Substrate

The packaging substrate can be directly used to carry the chip.

Application Overview:

By application, the Communications segment occupied the biggest share from 2018 to 2022.

Key Companies in the global Electronic Printed Circuit Board (PCB) market covered in Chapter 3:

Samsung Electro-Mechanics (SEMCO)
Tripod Technology Corporation
Shennan Circuits Company Limited
Unimicron Technology Corp.
TTM Technologies, Inc.
Shenzhen Kinwong Electronic Co., Ltd.
Fujikura
HannStar Board Corporation
AT&S
Zhen Ding Technology Holding Limited (ZDT)
Compeq Manufacturing Co., Ltd
NOK Corporation

In Chapter 4 and Chapter 14.2, on the basis of types, the Electronic Printed Circuit Board (PCB) market from 2018 to 2029 is primarily split into:

Rigid 1-2 sided
Standard multilayer
High-Density Interconnect (HDI)
Flexible circuits
Package Substrate

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Electronic Printed Circuit Board (PCB) market from 2018 to 2029 covers:

Computer/Peripherals
Communications
Consumer Electronics
Industrial Electronics
Automotive
Military/Aerospace
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)