Global Electronic Packaging Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global Electronic Packaging Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Market Overview:

The latest research study on the global Electronic Packaging market finds that the global Electronic Packaging market reached a value of USD 37676.0 million in 2022. It’s expected that the market will achieve USD 59244.0 million by 2028, exhibiting a CAGR of 7.84% during the forecast period.

Influence of COVID-19 Outbreak on Electronic Packaging Industry Development

More than one million lives have been lost to COVID-19 since the start of the year and the toll continues to rise. Many more have suffered serious illness. Close to 90 million people are expected to fall into extreme deprivation this year. Compared with the IMF report released in June, the global economic contraction in 2020 will not be as severe as previously predicted. This revision reflects a better-than-expected economic recovery in the second quarter. Global growth is projected at 5.2 percent in 2021, a little lower than in the June 2020 WEO Update, reflecting the more moderate downturn projected for 2020 and consistent with expectations of persistent social distancing. Following the contraction in 2020 and recovery in 2021, the level of global GDP in 2021 is expected to be a modest 0.6 percent above that of 2019. The growth projections imply wide negative output gaps and elevated unemployment rates this year and in 2021 across both advanced and emerging market economies.

In the current economic globalization, the upstream and downstream industrial chains have never been so closely connected. The COVID-19 pandemic around the world has caused a large number of factories to stop production, isolate employees, and block transportation. This will affect the raw material transportation of Electronic Packaging manufacturing companies. If the supply of raw materials is blocked, the production of Electronic Packaging will also be affected. Therefore, dealing with the impact of COVID-19 on the global supply chain will become one of the main issues that Electronic Packaging manufacturers need to deal with. In the short term, it is expected that the price of raw materials produced by Electronic Packaging will rise, which will put pressure on the cost control of Electronic Packaging producers.

Drivers

Electronic packaging is one of the important links in the electronics and semiconductor industries. The development of the electronics and semiconductor industries in recent years has greatly promoted the development of the electronic packaging industry and is the main driving force factor for the electronic packaging industry.

The current demand for new applications is growing rapidly, and the semiconductor industry is experiencing a boom in prosperity. In addition to the current consumer electronics, the development of future applications in industries such as artificial intelligence, 5G, and the Internet of Things will bring unprecedented new space to the semiconductor industry. The global semiconductor industry is expected to usher in a new round of business cycle, which will drive electronic packaging. The development of the industry.

Restraints

The trade policy fluctuations brought about by the China-US trade dispute have caused great instability to the world, and the impact on the electronic packaging and semiconductor industries is more obvious. This unstable trade policy will limit the enthusiasm for international investment in the electronic packaging industry because people are worried that policy changes will affect the sustainability of the company's operations. At the same time, various countries have seen the importance of the semiconductor industry, including electronic packaging, to national security. National and regional governments, including China and the European Union, have adopted various degrees of incentives for their industries. This situation will cause a certain degree of restrictions on the currently highly globalized electronic packaging industry.

Region Overview:

From 2023-2028, China is estimated to witness robust growth prospects.

Company Overview:

The top three companies are ASE Technology Holding, Co., Ltd., Amkor Technology, Inc. and Jcet group with the revenue market share of 16.51%, 13.09% and 11.72% in 2019.

Advanced Semiconductor Engineering Inc., is the leading provider of independent semiconductor manufacturing services in assembly and test. ASE develops and offers complete turnkey solutions in IC packaging, design and production of interconnect materials, front-end engineering test, wafer probing and final test, as well as electronic manufacturing services through USI, Inc.

Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. As the original pioneers of the OSAT industry, Amkor Technology has helped define and advance the technology manufacturing landscape. Since 1968, Amkor has delivered innovative packaging solutions with the service and capacity global customers rely on.

Segmentation Overview:

Among different product types, Organic Substrates segment is anticipated to contribute the largest market share in 2028.

Application Overview:

By application, the Semiconductor and IC segment occupied the biggest share from 2018 to 2022.

Key Companies in the global Electronic Packaging market covered in Chapter 3:

Shinko Electric
Hitachi Ltd.
ASE Technology Holding, Co., Ltd.
Infineon Technologies AG
Kyocera Group
Jcet group
AMETEK Inc
Tongfu Microelectronics Co., Ltd.
Powertech Technology Inc.
Amkor Technology, Inc.
Ibiden Co., Ltd.
DuPont

In Chapter 4 and Chapter 14.2, on the basis of types, the Electronic Packaging market from 2018 to 2029 is primarily split into:

Organic Substrates
Bonding Wires
Ceramic Packages
Others

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Electronic Packaging market from 2018 to 2029 covers:

Semiconductor and IC
PCB
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)