Global ABF Substrate (FC-BGA) Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global ABF Substrate (FC-BGA) Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

ABF (Ajinomoto build-up film) substrate has been a key component in chip manufacturing since its introduction. FC-BGA substrate is a high-density semiconductor packaging substrate that can realize high-speed and multi-functional LSI chips. It can be applied to CPUs, GPUs, high-end servers, ASICs for network routers/converters, MPUs for high-performance game machines, high-performance ASSPs, FPGA and ADAS in vehicle equipment, etc.

Market Overview:

The latest research study on the global ABF Substrate (FC-BGA) market finds that the global ABF Substrate (FC-BGA) market reached a value of USD 5779.88 million in 2022. It’s expected that the market will achieve USD 9865.43 million by 2028, exhibiting a CAGR of 9.32% during the forecast period.

Growth in demand for high-performance chips in the downstream market

The demand for high-performance and high-computing chips has soared, driving the demand for ABF Substrate (FC-BGA) to soar. Benefiting from the vigorous development of new application fields such as cloud technology and AI, the demand for AI chips has surged, and the demand for ABF Substrate (FC-BGA) has increased significantly. In addition, Apple, a leading consumer electronics manufacturer, has already started switching from FC-CSP to FC-BGA. Its M1 and M2 chips are both packaged in FC-BGA. AR products, which are planned to replace the iPhone within 10 years, are also planned to use ABF Substrate (FC-BGA).

In addition, 5G communication, artificial intelligence, cloud computing, autonomous driving, smart wearables, smart home and other product technology upgrades and application scenarios expansion have driven a substantial increase in the demand for high-performance chips in the electronics industry, thereby driving the global ABF Substrate (FC-BGA) industry market demand.

5G, AI, cloud service market development

The construction of 5G base stations drives the consumption of ABF Substrate (FC-BGA). With the advent of the 5G era, network chip manufacturers have also begun to use ABF Substrate (FC-BGA) in the manufacture of routers, base stations, etc. on a large scale, resulting in a soaring demand for ABF Substrate (FC-BGA). At the same time, new applications of cloud technology and artificial intelligence have also driven up the demand for ABF Substrate (FC-BGA). The COVID-19 epidemic has stimulated economic transformation, and the cloud service market is developing rapidly. As the hardware foundation of cloud services, the construction of data centers has accelerated the shipment of server CPUs and Chipsets. In addition, the implementation of artificial intelligence applications such as speech recognition and machine vision has stimulated the vigorous development of the artificial intelligence market, and the demand for artificial intelligence for CPU, GPU, and FPGA has soared.

In recent years, with the development of emerging applications such as 5G, cloud computing, and AI, the demand for processors has continued to increase. Due to the large size of new processors and the new packaging technology requiring more ABF Substrate (FC-BGA) layers, the demand for ABF Substrate (FC-BGA) is gradually increasing. This is driving the growth of the ABF Substrate (FC-BGA) industry.

Region Overview:

In 2021, the share of the ABF Substrate (FC-BGA) market in Asia Pacific stood at 73.89%.

Company Overview:

Unimicron is one of the major players operating in the ABF Substrate (FC-BGA) market, holding a share of 22.32% in 2022.

Nan Ya PCB doubles capex budget for 2022

4 March 2022

Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF substrates to meet persistently strong demand from chipmaking clients.

And, Nan Ya PCB announced plans to further expand fab capacities in Taiwan and China for high-end ABF substrates with the additional output set to come online by 2024.

Segmentation Overview:

By type, 8-16 Layers ABF Substrate segment accounted for the largest share of market in 2021.

Application Overview:

The market's largest segment by application is the segment PCs, with a market share of 47.32% in 2021.

Key Companies in the global ABF Substrate (FC-BGA) market covered in Chapter 3:

AT&S
Ibiden
Kyocera
Kinsus Interconnect Technology
Shinko Electric Industries
Semco
Unimicron
TOPPAN
Daeduck Electronics
Nan Ya PCB

In Chapter 4 and Chapter 14.2, on the basis of types, the ABF Substrate (FC-BGA) market from 2018 to 2029 is primarily split into:

4-8 Layers
8-16 Layers
Others

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the ABF Substrate (FC-BGA) market from 2018 to 2029 covers:

PCs
Server & Switch
Game Consoles
AI Chip
Communication Base Station
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)