Global 3D Silicon Interposer Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global 3D Silicon Interposer Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

An interposer, a silicon substrate made of silicon and organic materials, is the conduit through which electrical signals pass through multichip modules in advanced packaging. The intermediary layer is added between the substrate and the Die, which plays a role as a link between the previous and the next. With the help of the silicon intermediary channels extending in all directions, multiple Dies can be freely combined together, just like a giant underground transportation hub. The principle of a 3D Silicon Interposer is to make a transistor (CMOS) structure on the chip, and directly use TSV to connect the electronic signals of different chips up and down, so as to directly stack memory or other chips vertically on it.

Market Overview:

The latest research study on the global 3D Silicon Interposer market finds that the global 3D Silicon Interposer market reached a value of USD 69.07 million in 2022. It’s expected that the market will achieve USD 145.88 million by 2028, exhibiting a CAGR of 13.27% during the forecast period.

The impact of COVID-19 on the industrial chain

The COVID-19 epidemic will inevitably impact the production and operation of enterprises, hinder the circulation of the industrial chain, and have a negative impact on the economy of the 3D Silicon Interposer industry and downstream industries. Affected by the epidemic, many countries and regions have adopted measures such as grounding of flights, flight control, entry control, suspension of imports, and imposition of tariffs. Some cross-border logistics channels were forced to be interrupted, many factories were shut down, and the multinational manufacturing supply chain was affected. The key intermediate products, components, and production equipment required for industrial production in various countries will face a certain risk of disconnection on a global scale. Even countries with relatively well-established industrial sectors have been hit hard. This is mainly reflected in parts shortages, labor disruptions, traffic disruptions, products not being delivered to customers, and overall underutilization of capacity due to the aforementioned factors. What's more, many manufacturers rely heavily on rationing of inventory and bottleneck parts. The current form of the COVID-19 outbreak is not completely stable, and the impact on the 3D Silicon Interposer industry and downstream industries will continue.

Wide application range

3D packaging technology can not only deal with digital systems but also be applied to optical communication, sensors, MEMS, and other fields. According to the industry, it can be used in automotive electronics, medical electronics, GUP, consumer electronics, Bluetooth systems, military electronics, etc. For example, ECU in the automobile industry consists of a microprocessor (CPU), memory (ROM, RAM), input/output interface (I/O), analog-to-digital converter (A/D), and large-scale integrated circuits such as shaping and driving. The rapid development of these downstream industries, the development of new energy vehicles, and the advent of 5G have accelerated the iteration of smartphone product updates, all of which have driven the market demand for 3D Silicon Interposer.

Raw material prices fluctuate

The cost of raw materials is an important cost that is directly used to produce the product. The main raw material for 3D Silicon Interposers is silicon, so any fluctuations in the price of silicon could have an impact on profit margins. The demand in the silicon wafer industry continues to increase, and downstream silicon wafer companies have stabilized the supply of silicon materials by signing long-term orders that lock volume and not price. Due to the limited supply of upstream silicon materials, the start-up and production increase of silicon wafer companies are also restricted to a certain extent, which is also one of the factors driving the price fluctuation of silicon wafers. China is the world's largest producer of silicon, so the price of silicon could also be affected by fluctuations in the yuan and trade wars. Coupled with the impact of the new crown pneumonia epidemic on the global semiconductor supply chain, the dilemma of raw material shortage will also lead to price fluctuations.

Region Overview:

In 2021, the share of the 3D Silicon Interposer market in Asia Pacific stood at 81.48%.

Company Overview:

TSMC is one of the major players operating in the 3D Silicon Interposer market, holding a share of 40.67% in 2022.

TSMC

TSMC is one of the largest independent pure-play semiconductor foundries in the world. Designs and manufactures microchips for communications equipment, radios, televisions, medical equipment, and video games. Semiconductors manufactured by TSMC serve a large and diverse global customer base, including a wide range of applications. These products are used in a variety of end markets including mobile devices, high performance computing, automotive electronics and the Internet of Things (IoT).

Murata

Murata Manufacturing Co., Ltd. manufactures and sells electronic modules and components. The Company produces communication modules, power supply modules, multilayer ceramic capacitors, noise countermeasure components, timing devices, sensor devices, high frequency components, batteries, and other products.

Segmentation Overview:

By type, 100 µm to 500 µm segment accounted for the largest share of market in 2021.

Application Overview:

By application, the Memory segment occupied the biggest share from 2017 to 2022.

Key Companies in the global 3D Silicon Interposer market covered in Chapter 3:

Murata Manufacturing
TSMC
Plan Optik AG.
Atomica
ALLVIA, Inc

In Chapter 4 and Chapter 14.2, on the basis of types, the 3D Silicon Interposer market from 2018 to 2029 is primarily split into:

200 µm to 500 µm
500 µm to 1000 µm
Others

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the 3D Silicon Interposer market from 2018 to 2029 covers:

Imaging & Optoelectronics
Memory
MEMS/sensors
LED
Logic 3D sip/soc
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)