Embedded Chip Packaging Market Report: Trends, Forecast and Competitive Analysis to 2030

Embedded Chip Packaging Market Report: Trends, Forecast and Competitive Analysis to 2030

Embedded Chip Packaging Trends and Forecast

The future of the global embedded chip packaging market looks promising with opportunities in the tiny package and system-in-boards markets. The global embedded chip packaging market is expected to grow with a CAGR of 20.7% from 2024 to 2030. The major drivers for this market are continuous advancements in semiconductor packaging, include fan-out wafer-level packaging (FOWLP), system-in-package (SiP), 3D packaging, and heterogeneous integration, growing demand for thinner and smaller electronics across a variety of sectors, including wearables, smartphones, Internet of Things, and automotive electronics, as well as, increasing expectations from customers for improved usefulness and performance in electronic devices.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Embedded Chip Packaging by Segment

The study includes a forecast for the global embedded chip packaging by type, application, and region.

Embedded Chip Packaging Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Single Chip
• Multichip
• MEMS
• Passive Components
• Others

Embedded Chip Packaging Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• Tiny Package
• System-In-Boards
• Others

Embedded Chip Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Embedded Chip Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies embedded chip packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the embedded chip packaging companies profiled in this report include-

• ASE
• ATS
• GE
• Shinko
• Taiyo Yuden
• TDK
• Würth Elektronik
• Texas Instruments
• Siemens
• Infineon

Embedded Chip Packaging

Lucintel forecasts that single chip is expected to witness highest growth over the forecast period because the packages offer a simpler and more economical solution compared to multi-chip or other complex configurations.

APAC is expected to witness highest growth over the forecast period because the major manufacturers of electronics, like Apple, Samsung, and Huawei, have substantial production bases in the region, especially in China, owing to strong need for cutting-edge packaging options like integrated chips.

Features of the Global Embedded Chip Packaging Market

Market Size Estimates: Embedded chip packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Embedded chip packaging market size by type, application, and region in terms of value ($B).

Regional Analysis: Embedded chip packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the embedded chip packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the embedded chip packaging market.

Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

FAQ

Q1. What is the growth forecast for embedded chip packaging market?

Answer: The global embedded chip packaging market is expected to grow with a CAGR of 20.7% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the embedded chip packaging market?

Answer: The major drivers for this market are continuous advancements in semiconductor packaging, include fan-out wafer-level packaging (FOWLP), system-in-package (SiP), 3D packaging, and heterogeneous integration, growing demand for thinner and smaller electronics across a variety of sectors, including wearables, smartphones, Internet of Things, and automotive electronics, as well as, increasing expectations from customers for improved usefulness and performance in electronic devices.

Q3. What are the major segments for embedded chip packaging market?

Answer: The future of the global embedded chip packaging market looks promising with opportunities in the tiny package and system-in-boards markets.

Q4. Who are the key embedded chip packaging market companies?

Answer: Some of the key embedded chip packaging companies are as follows:

• ASE
• ATS
• GE
• Shinko
• Taiyo Yuden
• TDK
• Würth Elektronik
• Texas Instruments
• Siemens
• Infineon

Q5. Which embedded chip packaging market segment will be the largest in future?

Answer: Lucintel forecasts that single chip is expected to witness highest growth over the forecast period because the packages offer a simpler and more economical solution compared to multi-chip or other complex configurations.

Q6. In embedded chip packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period because the major manufacturers of electronics, like Apple, Samsung, and Huawei, have substantial production bases in the region, especially in China, owing to strong need for cutting-edge packaging options like integrated chips.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

Q.1. What are some of the most promising, high-growth opportunities for the embedded chip packaging market by type (single chip, multichip, mems, passive components, and others), application (tiny package, system-in-boards, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

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