Electronic Assembly Material Market Report: Trends, Forecast and Competitive Analysis to 2030

Electronic Assembly Material Market Report: Trends, Forecast and Competitive Analysis to 2030


Electronic Assembly Material Trends and Forecast

The future of the global electronic assembly material market looks promising with opportunities in the automotive, consumer & industrial, defense & aerospace, and handheld communications & computing markets. The global electronic assembly material market is expected to grow with a CAGR of 9.5% from 2024 to 2030. The major drivers for this market are rise in demand for electronic devices, miniaturization of electronic devices, and increasing deployment of 5G wireless network communications in the developing countries.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Electronic Assembly Material by Segment

The study includes a forecast for the global electronic assembly material by material type, end use, and region.

Electronic Assembly Material Market by Material Type [Shipment Analysis by Value from 2018 to 2030]:
  • Adhesives
  • Paste Fluxes
  • Electrically Conductive Materials
  • Thermal Interface Materials
Electronic Assembly Material Market by End Use [Shipment Analysis by Value from 2018 to 2030]:
  • Automotive
  • Consumer & Industrial
  • Defense & Aerospace
  • Handheld Communications & Computing
  • Other
Electronic Assembly Material Market by Region [Shipment Analysis by Value from 2018 to 2030]:
  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World
List of Electronic Assembly Material Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies electronic assembly material companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the electronic assembly material companies profiled in this report include-
  • Kelly Services
  • Hisco
  • Henkel Corporation
  • H.B. Fuller
  • ITW
Electronic Assembly Material Market Insights

Lucintel forecasts that electrically conductive material will remain the largest segment over the forecast period.

Within this market, automotive is expected to witness the highest growth due to increasing demand of materials that are lighter in weight, smaller in size, more cost-effective to manufacture, and have lower power consumption.

APAC is expected to witness highest growth over the forecast period due to significantly growing automotive sector and presence of major electronic suppliers in the region.

Features of the Global Electronic Assembly Material Market

Market Size Estimates: Electronic assembly material market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Electronic assembly material market size by material type, end use, and region in terms of value ($B).

Regional Analysis: Electronic assembly material market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different material types, end uses, and regions for the electronic assembly material market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the electronic assembly material market.

Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

FAQ

Q1. What is the growth forecast for electronic assembly material market?

Answer: The global electronic assembly material market is expected to grow with a CAGR of 9.5% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the electronic assembly material market?

Answer: The major drivers for this market are rise in demand for electronic devices, miniaturization of electronic devices, and increasing deployment of 5G wireless network communications in the developing countries.

Q3. What are the major segments for electronic assembly material market?

Answer: The future of the electronic assembly material market looks promising with opportunities in the automotive, consumer & industrial, defense & aerospace, and handheld communications & computing markets.

Q4. Who are the key electronic assembly material market companies?

Answer: Some of the key electronic assembly material companies are as follows:
  • Kelly Services
  • Hisco
  • Henkel Corporation
  • H.B. Fuller
  • ITW
Q5. Which electronic assembly material market segment will be the largest in future?

Answer: Lucintel forecasts that electrically conductive material will remain the largest segment over the forecast period.

Q6. In electronic assembly material market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to significantly growing automotive sector and presence of major electronic suppliers in the region.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

Q.1. What are some of the most promising, high-growth opportunities for the electronic assembly material market by material type (adhesives, paste fluxes, electrically conductive materials, and thermal interface materials), end use (automotive, consumer & industrial, defense & aerospace, handheld communications & computing, and other), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Please note: It will take 3 business days to deliver the report upon receipt the order.


1. Executive Summary
2. Global Electronic Assembly Material Market : Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges 
3. Market Trends and Forecast Analysis from 2018 to 2030
3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2. Global Electronic Assembly Material Market Trends (2018-2023) and Forecast (2024-2030)
3.3: Global Electronic Assembly Material Market by Material Type
3.3.1: Adhesives
3.3.2: Paste Fluxes
3.3.3: Electrically Conductive Materials
3.3.4: Thermal Interface Materials
3.4: Global Electronic Assembly Material Market by End Use
3.4.1: Automotive
3.4.2: Consumer & Industrial
3.4.3: Defense & Aerospace
3.4.4: Handheld Communications & Computing
3.4.5: Other
4. Market Trends and Forecast Analysis by Region from 2018 to 2030
4.1: Global Electronic Assembly Material Market by Region
4.2: North American Electronic Assembly Material Market
4.2.2: North American Electronic Assembly Material Market by End Use: Automotive, Consumer & Industrial, Defense & Aerospace, Handheld Communications & Computing, and Other
4.3: European Electronic Assembly Material Market
4.3.1: European Electronic Assembly Material Market by Material Type: Adhesives, Paste Fluxes, Electrically Conductive Materials, and Thermal Interface Materials
4.3.2: European Electronic Assembly Material Market by End Use: Automotive, Consumer & Industrial, Defense & Aerospace, Handheld Communications & Computing, and Other
4.4: APAC Electronic Assembly Material Market
4.4.1: APAC Electronic Assembly Material Market by Material Type: Adhesives, Paste Fluxes, Electrically Conductive Materials, and Thermal Interface Materials
4.4.2: APAC Electronic Assembly Material Market by End Use: Automotive, Consumer & Industrial, Defense & Aerospace, Handheld Communications & Computing, and Other
4.5: ROW Electronic Assembly Material Market
4.5.1: ROW Electronic Assembly Material Market by Material Type: Adhesives, Paste Fluxes, Electrically Conductive Materials, and Thermal Interface Materials
4.5.2: ROW Electronic Assembly Material Market by End Use: Automotive, Consumer & Industrial, Defense & Aerospace, Handheld Communications & Computing, and Other
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Electronic Assembly Material Market by Material Type
6.1.2: Growth Opportunities for the Global Electronic Assembly Material Market by End Use
6.1.3: Growth Opportunities for the Global Electronic Assembly Material Market by Region
6.2: Emerging Trends in the Global Electronic Assembly Material Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Electronic Assembly Material Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Electronic Assembly Material Market
6.3.4: Certification and Licensing
7. Company Profiles of Leading Players
7.1: Kelly Services
7.2: Hisco
7.3: Henkel Corporation
7.4: H.B. Fuller
7.5: ITW

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