Die Bonder Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030

Die Bonder Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030

Die Bonder Equipment Trends and Forecast

The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets. The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030 with a CAGR of 3.0% from 2024 to 2030. The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Die Bonder Equipment by Segment

The study includes a forecast for the global die bonder equipment by type, bonding technique, device, application, and region.

Die Bonder Equipment Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Manual Die Bonders
• Semiautomatic Die Bonders
• Fully Automatic Die Bonders

Die Bonder Equipment Market by Bonding Technique [Shipment Analysis by Value from 2018 to 2030]:

• Epoxy
• Eutectic
• Soft Solder
• Others

Die Bonder Equipment Market by Device [Shipment Analysis by Value from 2018 to 2030]:

• Optoelectronics
• MEMS and MOEMS
• Power Devices

Die Bonder Equipment Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• Consumer Electronics
• Automotive
• Industrial
• Telecommunications
• Healthcare
• Aerospace & Defense
• Others

Die Bonder Equipment Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Die Bonder Equipment Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies die bonder equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the die bonder equipment companies profiled in this report include-

• BE Semiconductor Industries
• ASM Pacific Technology
• Kulicke & Soffa
• Mycronic
• Palomar Technologies
• West·Bond
• MicroAssembly Technologies

Die Bonder Equipment Market Insights

Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.

APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.

Features of the Global Die Bonder Equipment Market

Market Size Estimates: Die bonder equipment market size estimation in terms of value ($M).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Die bonder equipment market size by bonding technique, device, application, and region in terms of value ($M).

Regional Analysis: Die bonder equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, bonding technique, device, application, and regions for the die bonder equipment market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the die bonder equipment market.

Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

FAQ

Q1. What is the die bonder equipment market size?

Answer: The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030.

Q2. What is the growth forecast for die bonder equipment market?

Answer: The global die bonder equipment market is expected to grow with a CAGR of 3.0% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the die bonder equipment market?

Answer: The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.

Q4. What are the major segments for die bonder equipment market?

Answer: The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets.

Q5. Who are the key die bonder equipment market companies?

Answer: Some of the key die bonder equipment companies are as follows:

• BE Semiconductor Industries
• ASM Pacific Technology
• Kulicke & Soffa
• Mycronic
• Palomar Technologies
• West·Bond
• MicroAssembly Technologies

Q6. Which die bonder equipment market segment will be the largest in future?

Answer: Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.

Q7. In die bonder equipment market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

Q.1. What are some of the most promising, high-growth opportunities for the die bonder equipment market by type (manual die bonders, semiautomatic die bonders, and fully automatic die bonders), bonding technique (epoxy, eutectic, soft solder, and others), device (optoelectronics, MEMS and MOEMS, and power devices), application (consumer electronics, automotive, industrial, telecommunications, healthcare, aerospace & defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

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