Broadband Power Line Communication Chipset Market Report: Trends, Forecast and Competitive Analysis to 2030

Broadband Power Line Communication Chipset Market Report: Trends, Forecast and Competitive Analysis to 2030


Broadband Power Line Communication Chipset Trends and Forecast

The future of the global broadband power line communication chipset market looks promising with opportunities in the smart grids, networking, lighting, security & surveillance, long haul, and machine to machine markets. The global broadband power line communication chipset market is expected to reach an estimated $8.5 billion by 2030 with a CAGR of 14.6% from 2024 to 2030. The major drivers for this market are rising use of smart grid technologies and rising demand for high-speed internet, growing government efforts to promote the development of smart cities, as well as, an increased emphasis on energy efficiency.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Broadband Power Line Communication Chipset by Segment

The study includes a forecast for the global broadband power line communication chipset by standards, technology, application, and region.

Broadband Power Line Communication Chipset Market by Standards [Shipment Analysis by Value from 2018 to 2030]:
  • Homeplug AV
  • Homeplug AV1
  • Homeplug AV2
  • IEEE 1901
  • IEEE 1905.1
  • G.Hn
  • HomePNA
  • Others
Broadband Power Line Communication Chipset Market by Technology [Shipment Analysis by Value from 2018 to 2030]:
  • Standalone
  • Hybrid
  • Wi-Fi
  • Zigbee
  • Ethernet
  • Others
Broadband Power Line Communication Chipset Market by Application [Shipment Analysis by Value from 2018 to 2030]:
  • Smart Grids
  • Networking
  • Lighting
  • Security & Surveillance
  • Long Haul
  • Machine To Machine
  • Others
Broadband Power Line Communication Chipset Market by Region [Shipment Analysis by Value from 2018 to 2030]:
  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World
List of Broadband Power Line Communication Chipset Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies broadband power line communication chipset companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the broadband power line communication chipset companies profiled in this report include-
  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies
Broadband Power Line Communication Chipset Market Insights

Lucintel forecasts that standalone will remain the largest segment over the forecast period because the standalone PLC chipsets only require a connection to the electrical grid, making them easy to install and ideal for retrofitting existing homes and buildings.

APAC will remain the largest region over the forecast period due to strong demand for internet access in the region.

Features of the Global Broadband Power Line Communication Chipset Market

Market Size Estimates: Broadband power line communication chipset market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Broadband power line communication chipset market size by various segments, such as by standards, technology, application, and region in terms of value ($B).

Regional Analysis: Broadband power line communication chipset market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different standards, technology, application, and regions for the broadband power line communication chipset market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the broadband power line communication chipset market.

Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

FAQ

Q1. What is the broadband power line communication chipset market size?

Answer: The global broadband power line communication chipset market is expected to reach an estimated $8.5 billion by 2030.

Q2. What is the growth forecast for broadband power line communication chipset market?

Answer: The global broadband power line communication chipset market is expected to grow with a CAGR of 14.6% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the broadband power line communication chipset market?

Answer: The major drivers for this market are rising use of smart grid technologies and rising demand for high-speed internet, growing government efforts to promote the development of smart cities, as well as, an increased emphasis on energy efficiency.

Q4. What are the major segments for broadband power line communication chipset market?

Answer: The future of the global broadband power line communication chipset market looks promising with opportunities in the smart grids, networking, lighting, security & surveillance, long haul, and machine to machine markets.

Q5. Who are the key broadband power line communication chipset market companies?

Answer: Some of the key broadband power line communication chipset companies are as follows:
  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies
Q6. Which broadband power line communication chipset market segment will be the largest in future?

Answer: Lucintel forecasts that standalone will remain the largest segment over the forecast period because the standalone PLC chipsets only require a connection to the electrical grid, making them easy to install and ideal for retrofitting existing homes and buildings.

Q7. In broadband power line communication chipset market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to strong demand for internet access in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

Q.1. What are some of the most promising, high-growth opportunities for the broadband power line communication chipset market by standards (homeplug AV, homeplug AV1, homeplug AV2, IEEE 1901, IEEE 1905.1, G.Hn, homePNA, and others), technology (standalone, hybrid, Wi-Fi, zigbee, ethernet, and others), application (smart grids, networking, lighting, security & surveillance, long haul, machine to machine, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Please note: It will take 3 business days to deliver the report upon receipt the order.


1. Executive Summary
2. Global Broadband Power Line Communication Chipset Market : Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges 
3. Market Trends and Forecast Analysis from 2018 to 2030
3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2. Global Broadband Power Line Communication Chipset Market Trends (2018-2023) and Forecast (2024-2030)
3.3: Global Broadband Power Line Communication Chipset Market by Standards
3.3.1: Homeplug AV
3.3.2: HomePlug AV1
3.3.3: HomePlug AV2
3.3.4: IEEE 1901
3.3.5: IEEE 1905.1
3.3.6: G.Hn
3.3.7: HomePNA
3.3.8: Others
3.4: Global Broadband Power Line Communication Chipset Market by Technology
3.4.1: Standalone
3.4.2: Hybrid
3.4.3: Wi-Fi
3.4.4: Zigbee
3.4.5: Ethernet
3.4.6: Others
3.5: Global Broadband Power Line Communication Chipset Market by Application
3.5.1: Smart Grids
3.5.2: Networking
3.5.3: Lighting
3.5.4: Security & Surveillance
3.5.5: Long Haul
3.5.6: Machine to Machine
3.5.7: Others
4. Market Trends and Forecast Analysis by Region from 2018 to 2030
4.1: Global Broadband Power Line Communication Chipset Market by Region
4.2: North American Broadband Power Line Communication Chipset Market
4.2.1: North American Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
4.2.2: North American Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
4.3: European Broadband Power Line Communication Chipset Market
4.3.1: European Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
4.3.2: European Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
4.4: APAC Broadband Power Line Communication Chipset Market
4.4.1: APAC Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
4.4.2: APAC Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
4.5: ROW Broadband Power Line Communication Chipset Market
4.5.1: ROW Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
4.5.2: ROW Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Standards
6.1.2: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Technology
6.1.3: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Application
6.1.4: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Region
6.2: Emerging Trends in the Global Broadband Power Line Communication Chipset Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Broadband Power Line Communication Chipset Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Broadband Power Line Communication Chipset Market
6.3.4: Certification and Licensing
7. Company Profiles of Leading Players
7.1: Broadcom
7.2: Intel
7.3: Marvell Technology
7.4: Maxim Integrated
7.5: Megachips
7.6: Qualcomm
7.7: Semtech
7.8: ST Microelectronics
7.9: Vango Technologies
7.10: Yitran Technologies

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