Global Through-hole Technology Market Growth (Status and Outlook) 2025-2031

The global Through-hole Technology market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

Surface-mount technology (SMT) has become more dominant in the electronics manufacturing industry due to its smaller form factor and higher component density. However, through-hole technology is still relevant for specific applications and industries. Through-hole technology remains popular in industries where ruggedness, reliability, and long product lifecycles are crucial, such as aerospace, defense, automotive, and industrial equipment. Through-hole technology is commonly used for electromechanical components like connectors, relays, and switches, where mechanical strength and durability are essential.

LPI (LP Information)' newest research report, the “Through-hole Technology Industry Forecast” looks at past sales and reviews total world Through-hole Technology sales in 2024, providing a comprehensive analysis by region and market sector of projected Through-hole Technology sales for 2025 through 2031. With Through-hole Technology sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Through-hole Technology industry.

This Insight Report provides a comprehensive analysis of the global Through-hole Technology landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Through-hole Technology portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Through-hole Technology market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Through-hole Technology and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Through-hole Technology.

This report presents a comprehensive overview, market shares, and growth opportunities of Through-hole Technology market by product type, application, key players and key regions and countries.

Segmentation by Type:
Wirewound Type
Axial Type

Segmentation by Application:
Vehicle
Electronics
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
CEM
EUROCIRCUITS
DigiSource
Yun Industrial Acme PCB Assembly
Newbury Electronics
Tempo
WellPCB
JLCPCB
Valley Services Electronics
EMSG
API
OurPCB Tech
PCBGOGO
Semecs
WORLD Electronics
Technotronix
DDM Novastar
Comptek
Hughes Electronics
Advanced Technology & Manufacturing
ALLPCB
AirBorn
EMS Solutions
Vishay Intertechnology
TE Connectivity
Panasonic
Bourns
EPCOS (a TDK Group Company)
NTE Electronics
Cornell Dubilier Electronics

Please note: The report will take approximately 2 business days to prepare and deliver.