Global Wire Bonder and Die Bonder Market Growth 2025-2031

The global Wire Bonder and Die Bonder market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

LP Information, Inc. (LPI) ' newest research report, the “Wire Bonder and Die Bonder Industry Forecast” looks at past sales and reviews total world Wire Bonder and Die Bonder sales in 2024, providing a comprehensive analysis by region and market sector of projected Wire Bonder and Die Bonder sales for 2025 through 2031. With Wire Bonder and Die Bonder sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wire Bonder and Die Bonder industry.

This Insight Report provides a comprehensive analysis of the global Wire Bonder and Die Bonder landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wire Bonder and Die Bonder portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wire Bonder and Die Bonder market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wire Bonder and Die Bonder and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wire Bonder and Die Bonder.

This report presents a comprehensive overview, market shares, and growth opportunities of Wire Bonder and Die Bonder market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Fully Automatic Type
Semi-Automatic Type
Manual Type

Segmentation by Application:
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Besi
F&S BONDTEC
ASMPT
West•Bond
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
Hybond

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wire Bonder and Die Bonder market?

What factors are driving Wire Bonder and Die Bonder market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Wire Bonder and Die Bonder market opportunities vary by end market size?

How does Wire Bonder and Die Bonder break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.