Global Wafer-level Packaging Equipment Market Growth 2025-2031

Global Wafer-level Packaging Equipment Market Growth 2025-2031

The global Wafer-level Packaging Equipment market size is predicted to grow from US$ 3030 million in 2025 to US$ 5236 million in 2031; it is expected to grow at a CAGR of 9.5% from 2025 to 2031.

Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.

Global Wafer-level Packaging Equipment key players include Applied Materials, Tokyo Electron, KLA-Tencor Corporation, EV Group, etc. Global top four manufacturers hold a share nearly 60%.

China Taiwan is the largest market, with a share about 30%, followed by China Mainland, and North America, both have a share about 35 percent.

In terms of product, Fan-in WLP is the largest segment, followed by Fan-out WLP, etc.

LP Information, Inc. (LPI) ' newest research report, the “Wafer-level Packaging Equipment Industry Forecast” looks at past sales and reviews total world Wafer-level Packaging Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer-level Packaging Equipment sales for 2025 through 2031. With Wafer-level Packaging Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer-level Packaging Equipment industry.

This Insight Report provides a comprehensive analysis of the global Wafer-level Packaging Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer-level Packaging Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer-level Packaging Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer-level Packaging Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer-level Packaging Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer-level Packaging Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Fan In
Fan Out
Others

Segmentation by Application:
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Disco
SEMES
Suss Microtec
Veeco/CNT
Rudolph Technologies

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer-level Packaging Equipment market?

What factors are driving Wafer-level Packaging Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Wafer-level Packaging Equipment market opportunities vary by end market size?

How does Wafer-level Packaging Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.