Global Wafer Thinning Grinding Wheel Market Growth 2025-2031

The global Wafer Thinning Grinding Wheel market size is predicted to grow from US$ 99 million in 2025 to US$ 167 million in 2031; it is expected to grow at a CAGR of 9.1% from 2025 to 2031.

A Wafer Thinning Grinding Wheel is a specialized abrasive tool used in semiconductor manufacturing to reduce the thickness of silicon wafers while maintaining their structural integrity and surface quality. This process, known as wafer thinning, is critical for producing ultra-thin wafers used in advanced electronic devices like smartphones, microprocessors, and memory chips. The grinding wheel typically features a diamond abrasive layer, ensuring precision, minimal damage, and high efficiency. Its design and material composition are optimized to handle the delicate nature of wafers while achieving the required thickness and flatness.

United States market for Wafer Thinning Grinding Wheel is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Wafer Thinning Grinding Wheel is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Wafer Thinning Grinding Wheel is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Wafer Thinning Grinding Wheel players cover Tokyo Diamond, Disco, Asahi Diamond, Saint-Gobain, Tyrolit Group, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Wafer Thinning Grinding Wheel Industry Forecast” looks at past sales and reviews total world Wafer Thinning Grinding Wheel sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Thinning Grinding Wheel sales for 2025 through 2031. With Wafer Thinning Grinding Wheel sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Thinning Grinding Wheel industry.

This Insight Report provides a comprehensive analysis of the global Wafer Thinning Grinding Wheel landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Thinning Grinding Wheel portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Thinning Grinding Wheel market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Thinning Grinding Wheel and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Thinning Grinding Wheel.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Thinning Grinding Wheel market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Vitrified Bond
Resinoid Bond
Others

Segmentation by Application:
Rough Grinding
Fine Grinding

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Tokyo Diamond
Disco
Asahi Diamond
Saint-Gobain
Tyrolit Group
Noritake
Kinik
EHWA Diamond
Shinhan Diamond
Qingdao Gaoce Technology
Kure Grinding Wheel
Zhengzhou Research Institute For Abrasives & Grinding
Suzhou Sail Science & Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer Thinning Grinding Wheel market?

What factors are driving Wafer Thinning Grinding Wheel market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Wafer Thinning Grinding Wheel market opportunities vary by end market size?

How does Wafer Thinning Grinding Wheel break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.