The global Wafer Tape Mounter market size is predicted to grow from US$ 127 million in 2025 to US$ 172 million in 2031; it is expected to grow at a CAGR of 5.1% from 2025 to 2031.
Wafer Tape Mounter is also known as wafer tape installation device. It is used to fix the wafer on the metal frame with wafer adhesive tape, to realize the accurate positioning between the wafer and the metal frame, and ensure multiple subsequent processes such as stealth dicing and inspection.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
LP Information, Inc. (LPI) ' newest research report, the “Wafer Tape Mounter Industry Forecast” looks at past sales and reviews total world Wafer Tape Mounter sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Tape Mounter sales for 2025 through 2031. With Wafer Tape Mounter sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Tape Mounter industry.
This Insight Report provides a comprehensive analysis of the global Wafer Tape Mounter landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Tape Mounter portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Tape Mounter market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Tape Mounter and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Tape Mounter.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Tape Mounter market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Manual
Semi Automatic
Fully-automatic
Segmentation by Application:
6 Inch Wafer
8 Inch Wafer
12 Inch Wafer
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Nitto Denko
LINTEC Corporation
Takatori Corporation
DISCO Corporation
Teikoku Taping System
NPMT (NDS)
Dynatech
CUON Solution
Ultron Systems
Semiconductor Equipment Corporation
AE Advanced Engineering
Powatec
N-TEC
TOYO ADTEC
Waftech
Advanced Dicing Technologies (ADT)
Jiangsu Jcxj
Heyan Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Tape Mounter market?
What factors are driving Wafer Tape Mounter market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Tape Mounter market opportunities vary by end market size?
How does Wafer Tape Mounter break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.
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