Global Wafer Tape Market Growth 2024-2030

Global Wafer Tape Market Growth 2024-2030

According to our LPI (LP Information) latest study, the global Wafer Tape market size was valued at US$ 676 million in 2023. With growing demand in downstream market, the Wafer Tape is forecast to a readjusted size of US$ 1045.7 million by 2030 with a CAGR of 6.4% during review period.

The research report highlights the growth potential of the global Wafer Tape market. Wafer Tape are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of Wafer Tape. Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the Wafer Tape market.

Tapes are mainly used in two major processes of wafer back grinding and wafer dicing in semiconductor applications. Both grinding tape and dicing tape include Non-UV Tape and UV Tape. Non-UV type is the general traditional pressure-sensitive tape. Considering the easy peelability, its adhesive force is generally lower than that of UV type (before UV exposure), which is about 100~400 gf/25mm; UV type tape is a kind of tape with The peeling force of pressure-sensitive tape with high adhesive strength will be greatly reduced after exposure to UV light. It not only has strong fixation to the adhered object, but also has the advantage of being easy to peel off after the process purpose is achieved.

The industry will experience major ups and downs in 2022, according to World Semiconductor Trade Statistics (WSTS). While chip sales reached their highest-ever annual total in 2022, a slowdown in the second half of the year significantly limited growth. In 2022, global semiconductor sales will reach 574 billion U.S. dollars, of which U.S. semiconductor companies will have a total sales of 275 billion U.S. dollars, accounting for 48% of the global market.

The top five global wafer tape companies are Mitsui Chemicals Tohcello, Nitto Denko, LINTEC Corporation, Furukawa Electric and Denka, with market shares exceeding 60%.

For the tape process, as downstream customers continue to increase their requirements for product quality stability and delivery speed, more stringent requirements are put forward for the company's process design, production line customization and debugging, product yield, and production capacity. From the perspective of global competition, the global semiconductor materials industry is still dominated by Japan, the United States, South Korea and other countries and regions. Although the sales scale of China's semiconductor materials continues to increase, there is still a large gap between China's semiconductor material companies and global industry leaders in terms of overall technical level and scale.

Key Features:

The report on Wafer Tape market reflects various aspects and provide valuable insights into the industry.

Market Size and Growth: The research report provide an overview of the current size and growth of the Wafer Tape market. It may include historical data, market segmentation by Type (e.g., UV Type, Non-UV Type), and regional breakdowns.

Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the Wafer Tape market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.

Competitive Landscape: The research report provides analysis of the competitive landscape within the Wafer Tape market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.

Technological Developments: The research report can delve into the latest technological developments in the Wafer Tape industry. This include advancements in Wafer Tape technology, Wafer Tape new entrants, Wafer Tape new investment, and other innovations that are shaping the future of Wafer Tape.

Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the Wafer Tape market. It includes factors influencing customer ' purchasing decisions, preferences for Wafer Tape product.

Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the Wafer Tape market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting Wafer Tape market. The report also evaluates the effectiveness of these policies in driving market growth.

Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the Wafer Tape market.

Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the Wafer Tape industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.

Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the Wafer Tape market.

Market Segmentation:

Wafer Tape market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Segmentation by type
UV Type
Non-UV Type

Segmentation by application
Wafer Backing Grinding
Wafer Dicing

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals Tohcello
Nitto Denko
LINTEC Corporation
Furukawa Electric
Denka
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
Maxell Holdings, Ltd
NPMT(NDS)
KGK Chemical Corporation
Nexteck
Taicang Zhanxin Adhesive Material
Taizhou Wisifilm
Suzhou Boyanuvtape
Zhangjiagang Vistaic

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer Tape market?

What factors are driving Wafer Tape market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Wafer Tape market opportunities vary by end market size?

How does Wafer Tape break out type, application?

Please note: The report will take approximately 2 business days to prepare and deliver.