Global Wafer Slicing Equipment Market Growth 2025-2031

The global Wafer Slicing Equipment market size is predicted to grow from US$ 934 million in 2025 to US$ 1235 million in 2031; it is expected to grow at a CAGR of 4.8% from 2025 to 2031.

Wafer Slicing Equipment(that is, the Wafer scribing machine) is mainly used for packaging, is the Wafer that contain a lot of chip (Wafer) into one device, a chip particles current industry are mainly composed of mechanical blade, including the main shaft, control system, etc., due to cutting matrix for semiconductor devices, so the product yield and higher control requirements.

Global key wafer slicing equipment manufacturers include DISCO, Tokyo Seimitsu etc.The top 1 company hold a share about 60%.Chinese Mainland is the largest market, with a share about 40%, followed by Taiwan, China and South Korea with the share about 27% and 10%.

LP Information, Inc. (LPI) ' newest research report, the “Wafer Slicing Equipment Industry Forecast” looks at past sales and reviews total world Wafer Slicing Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Slicing Equipment sales for 2025 through 2031. With Wafer Slicing Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Slicing Equipment industry.

This Insight Report provides a comprehensive analysis of the global Wafer Slicing Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Slicing Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Slicing Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Slicing Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Slicing Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Slicing Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Blade Cutting Machine
Laser Cutting Machine

Segmentation by Application:
Pure Foundry
IDM
OSAT
LED
Photovoltaic

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO
Tokyo Seimitsu
GL Tech Co Ltd
ASM
Synova
CETC Electronics Equipment Group Co., Ltd.
Shenyang Heyan Technology Co., Ltd.
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
Hi-TESI
Tensun

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer Slicing Equipment market?

What factors are driving Wafer Slicing Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Wafer Slicing Equipment market opportunities vary by end market size?

How does Wafer Slicing Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.