Global Wafer Level Package Market Growth (Status and Outlook) 2024-2030
According to this study, the global Wafer Level Package market size will reach US$ 32390 million by 2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Level Package market by product type, application, key players and key regions and countries.
Segmentation by product type: 3D Wire Bonding 3D TSV Others
Segmentation by Application: Consumer Electronics Industrial Automotive & Transport IT & Telecommunication Others
This report also splits the market by region: United States China Europe Other regions: Japan South Korea Southeast Asia Rest of world
The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report: lASE Amkor Intel Samsung AT&S Toshiba JCET Qualcomm IBM SK Hynix UTAC TSMC China Wafer Level CSP Interconnect Systems
Please note: The report will take approximately 2 business days to prepare and deliver.
*This is a tentative TOC and the final deliverable is subject to change.*