Global Wafer Grinding Tapes Market Growth 2023-2029

Global Wafer Grinding Tapes Market Growth 2023-2029

Wafer Grinding Tapes is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.

LPI (LP Information)' newest research report, the “Wafer Grinding Tapes Industry Forecast” looks at past sales and reviews total world Wafer Grinding Tapes sales in 2022, providing a comprehensive analysis by region and market sector of projected Wafer Grinding Tapes sales for 2023 through 2029. With Wafer Grinding Tapes sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Grinding Tapes industry.

This Insight Report provides a comprehensive analysis of the global Wafer Grinding Tapes landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Grinding Tapes portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Wafer Grinding Tapes market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Grinding Tapes and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Grinding Tapes.

The global Wafer Grinding Tapes market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.

United States market for Wafer Grinding Tapes is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

China market for Wafer Grinding Tapes is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Europe market for Wafer Grinding Tapes is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Global key Wafer Grinding Tapes players cover Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology, Force-One Applied Materials and AMC Co, Ltd, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Grinding Tapes market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
UV Type
Non-UV Type

Segmentation by application
Standard
Standard Thin Die
(S)DBG(GAL)
Bump

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
Force-One Applied Materials
AMC Co, Ltd
Pantech Tape Co., Ltd

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer Grinding Tapes market?

What factors are driving Wafer Grinding Tapes market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Wafer Grinding Tapes market opportunities vary by end market size?

How does Wafer Grinding Tapes break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.