Global Wafer Grinding and Dicing Service Market Growth 2024-2030

Global Wafer Grinding and Dicing Service Market Growth 2024-2030

Wafer backgrinding, also known as Wafer thinning, is a semiconductor device fabrication step during which wafer thickness is reduced to allow for stacking and high density packaging of integrated circuits (IC).

The global Wafer Grinding and Dicing Service market size is projected to grow from US$ 574 million in 2024 to US$ 995 million in 2030; it is expected to grow at a CAGR of 9.6% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “Wafer Grinding and Dicing Service Industry Forecast” looks at past sales and reviews total world Wafer Grinding and Dicing Service sales in 2023, providing a comprehensive analysis by region and market sector of projected Wafer Grinding and Dicing Service sales for 2024 through 2030. With Wafer Grinding and Dicing Service sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Grinding and Dicing Service industry.

This Insight Report provides a comprehensive analysis of the global Wafer Grinding and Dicing Service landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Grinding and Dicing Service portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Grinding and Dicing Service market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Grinding and Dicing Service and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Grinding and Dicing Service.

Global key players of Wafer Grinding and Dicing Service include Micross Components, QP Technologies, Integra Technologies, Suzhou Baikejing Electronic Technology, YoungTek Electronics Corp., etc. The top five players hold a share about 26%. Asia-Pacific is the largest market, and has a share about 73%, followed by North America and Europe with share 17% and 8%, separately. In terms of product type, 300mm Wafer is the largest segment, occupied for a share of 78%. In terms of application, Logic Chip is the largest field with a share about 36 percent.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Grinding and Dicing Service market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
300mm Wafer
200mm Wafer
Others

Segmentation by Application:
Memory Chip
Logic Chip
Optical Sensor
MEMS
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Suzhou Baikejing Electronic Technology
Yima Semiconductor
Universen Hitec ltd
YoungTek Electronics Corp.
Integrated Service Technology Inc (iST)
Chnchip Integrated Circuit Co.,Ltd
Guangdong Leadyo IC Testing
King Long Technology
Shanghai Fine Chip Semiconductor
Jiangsu Nepes Semiconductor
Innotronix
Qipu Electronic Technology (Nantong) Co., Ltd
Micross Components
QP Technologies
Integra Technologies
MPE, Inc. (Micro Precision Engineering)
SVM (Silicon Valley Microelectronics)
GDSI (Grinding & Dicing Services Inc.)
Syagrus Systems
APD (American Precision Dicing, Inc)
Optim Wafer Services
NICHIWA KOGYO CO.,LTD.
High Components Aomori, Inc
FuRex
Intech Technologies International

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer Grinding and Dicing Service market?

What factors are driving Wafer Grinding and Dicing Service market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Wafer Grinding and Dicing Service market opportunities vary by end market size?

How does Wafer Grinding and Dicing Service break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.