Global Wafer Grinder Market Growth 2025-2031

The global Wafer Grinder market size is predicted to grow from US$ 1019 million in 2025 to US$ 1561 million in 2031; it is expected to grow at a CAGR of 7.4% from 2025 to 2031.

Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.

The key players of Wafer Grinder include Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. The top five players of Wafer Grinder account for approximately 89% of the total market. Asia-Pacific is the largest market of Wafer Grinder accounting for about 77%, followed by America and Europe, with share 15% and 8%, separately. In terms of product type, fully automatic is the largest segment, occupied for a share of about 51%, and in terms of application, 300mm wafer is the largest segment, occupied for a share of about 82%.

LP Information, Inc. (LPI) ' newest research report, the “Wafer Grinder Industry Forecast” looks at past sales and reviews total world Wafer Grinder sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Grinder sales for 2025 through 2031. With Wafer Grinder sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Grinder industry.

This Insight Report provides a comprehensive analysis of the global Wafer Grinder landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Grinder portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Grinder market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Grinder and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Grinder.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Grinder market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

Fully Automatic Wafer Grinders

Semi-Automatic Wafer Grinders

Segmentation by Application:

200mm Wafer

300mm Wafer

Others

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

Disco

TOKYO SEIMITSU

G&N

Okamoto Semiconductor Equipment Division

CETC

Koyo Machinery

Revasum

WAIDA MFG

Hunan Yujing Machine Industrial

SpeedFam

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer Grinder market?

What factors are driving Wafer Grinder market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Wafer Grinder market opportunities vary by end market size?

How does Wafer Grinder break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.