Global Wafer Expander Separator Market Growth 2025-2031

The global Wafer Expander Separator market size is predicted to grow from US$ 109 million in 2025 to US$ 266 million in 2031; it is expected to grow at a CAGR of 15.9% from 2025 to 2031.

Wafer expander is also called wafer expander separator. The wafer after dicing is expanded to increase the gap between independent dies, which is easy to be picked up and packed. After the stealth dicing, the modified layer inside the wafer is stretched by lifting and expanding actions, so that the wafer cracks along the modified layer, forming neat and controllable dicing cracks.

DISCO, Ohmiya Industry and N-TEC Corp. are the top 3 players of Wafer Expander Separator, with about 70% market shares. Asia-Pacific is the largest market, has a share about 81%, followed by Europe and North America, with share 5% and 12%, separately. In terms of product type, semi-automatic is the largest segment, occupied for a share of 68%.

LP Information, Inc. (LPI) ' newest research report, the “Wafer Expander Separator Industry Forecast” looks at past sales and reviews total world Wafer Expander Separator sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Expander Separator sales for 2025 through 2031. With Wafer Expander Separator sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Expander Separator industry.

This Insight Report provides a comprehensive analysis of the global Wafer Expander Separator landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Expander Separator portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Expander Separator market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Expander Separator and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Expander Separator.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Expander Separator market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

Semi-Automatic

Fully Automatic

Segmentation by Application:

6 & 8 Inch Wafer

12 Inch Wafer

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

DISCO

Ohmiya Industry

Dynatex International

Techvision

N-TEC Corp.

Semiconductor Equipment Corp

Toyo Adtec

Ultron Systems

Powatec

NeonTech

CHN.GIE

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer Expander Separator market?

What factors are driving Wafer Expander Separator market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Wafer Expander Separator market opportunities vary by end market size?

How does Wafer Expander Separator break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.