Global Wafer Bonder Market Growth 2023-2029

Global Wafer Bonder Market Growth 2023-2029

Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.
LPI (LP Information)' newest research report, the “Wafer Bonder Industry Forecast” looks at past sales and reviews total world Wafer Bonder sales in 2022, providing a comprehensive analysis by region and market sector of projected Wafer Bonder sales for 2023 through 2029. With Wafer Bonder sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Bonder industry.
This Insight Report provides a comprehensive analysis of the global Wafer Bonder landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Bonder portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Wafer Bonder market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Bonder and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Bonder.
The global Wafer Bonder market size is projected to grow from US$ 134.8 million in 2022 to US$ 230.8 million in 2029; it is expected to grow at a CAGR of 230.8 from 2023 to 2029.
The global wafer bonding machine market is relatively concentrated, and the major manufacturers in the international market include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE, etc. Austria EV Group is the world's leading enterprise, accounting for 55.05% of the global revenue in 2019. Germany's SUSS MicroTec is the second largest company in the world, accounting for 21.62% of the global market.Tokyo Electron, AML, Mitsubishi, Ayumi Industry and SMEE together have a market share of nearly 20%.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Bonder market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
Semi-Automated Wafer Bonder
Automated Wafer Bonder
Segmentation by application
MEMS
Advanced Packaging
CMOS
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
EV Group
SUSS MicroTec
Tokyo Electron
AML
Mitsubishi
Ayumi Industry
SMEE
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Bonder market?
What factors are driving Wafer Bonder market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Bonder market opportunities vary by end market size?
How does Wafer Bonder break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.