Global Underfills for Semiconductor Market Growth 2025-2031

Global Underfills for Semiconductor Market Growth 2025-2031

The global Underfills for Semiconductor market size is predicted to grow from US$ 640 million in 2025 to US$ 1080 million in 2031; it is expected to grow at a CAGR of 9.1% from 2025 to 2031.

Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave flow marks after curing, high heat resistance, high moisture resistance, moisture resistance, good reflow soldering, high purity, low alpha line. The Underfills for Semiconductor industry can be broken down into several segments, Chip-on-film Underfills, Flip Chip Underfills, CSP/BGA Board Level Underfills, etc. Across the world, the major players cover Panasonic, Master Bond, Showa Denko, Henkel, LORD Corporation, NAMICS, Shin-Etsu, United Adhesives, Nagase ChemteX, Panacol-Elosol, etc.

Global key players of Underfills for Semiconductor include Henkel, Won Chemical, NAMICS, Showa Denko, etc. Global top three manufacturers hold a share over 50%. The global Underfills for Semiconductor are mainly produced in China, Taiwan, China, North America, South Korea and Europe, they occupied for a share above 90 percent. Based on the product type, Underfills for Semiconductor is primarily split into Chip-on-film Underfills, Flip Chip Underfills, and CSP/BGA Board Level Underfills. Based on the Underfills for Semiconductor application, Underfills for Semiconductor market is segmented into several parts, like Industrial Electronics, Defense & Aerospace Electronics, Consumer Electronics, Automotive Electronics, and Medical Electronics, etc.

LP Information, Inc. (LPI) ' newest research report, the “Underfills for Semiconductor Industry Forecast” looks at past sales and reviews total world Underfills for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected Underfills for Semiconductor sales for 2025 through 2031. With Underfills for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Underfills for Semiconductor industry.

This Insight Report provides a comprehensive analysis of the global Underfills for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Underfills for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Underfills for Semiconductor market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Underfills for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Underfills for Semiconductor.

This report presents a comprehensive overview, market shares, and growth opportunities of Underfills for Semiconductor market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Chip-on-film Underfills
Flip Chip Underfills
CSP/BGA Board Level Underfills

Segmentation by Application:
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Henkel
Won Chemical
NAMICS
Showa Denko
Panasonic
MacDermid (Alpha Advanced Materials)
Shin-Etsu
Sunstar
Fuji Chemical
Zymet
Shenzhen Dover
Threebond
AIM Solder
Darbond
Master Bond
Hanstars
Nagase ChemteX
LORD Corporation
Asec Co., Ltd.
Everwide Chemical
Bondline
Panacol-Elosol
United Adhesives
U-Bond
Shenzhen Cooteck Electronic Material Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Underfills for Semiconductor market?

What factors are driving Underfills for Semiconductor market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Underfills for Semiconductor market opportunities vary by end market size?

How does Underfills for Semiconductor break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.