Global Underfill Market Growth 2025-2031

The global Underfill market size is predicted to grow from US$ 464 million in 2025 to US$ 579 million in 2031; it is expected to grow at a CAGR of 3.7% from 2025 to 2031.

This report studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.

North America is the largest market with about 38% market share. China is follower, accounting for about 20% market share.

The key players are Henkel, WON CHEMICAL, NAMICS, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond, DOVER, Darbond, HIGHTITE, U-bond etc. Top 3 companies occupied about 45% market share.

LP Information, Inc. (LPI) ' newest research report, the “Underfill Industry Forecast” looks at past sales and reviews total world Underfill sales in 2024, providing a comprehensive analysis by region and market sector of projected Underfill sales for 2025 through 2031. With Underfill sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Underfill industry.

This Insight Report provides a comprehensive analysis of the global Underfill landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Underfill portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Underfill market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Underfill and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Underfill.

This report presents a comprehensive overview, market shares, and growth opportunities of Underfill market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Semiconductor Underfills
Board Level Underfills

Segmentation by Application:
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
U-bond

Key Questions Addressed in this Report

What is the 10-year outlook for the global Underfill market?

What factors are driving Underfill market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Underfill market opportunities vary by end market size?

How does Underfill break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.