Global UV and Non-UV Tape for Semiconductor Market Growth 2025-2031

Global UV and Non-UV Tape for Semiconductor Market Growth 2025-2031

The global UV and Non-UV Tape for Semiconductor market size is predicted to grow from US$ 700 million in 2025 to US$ 966 million in 2031; it is expected to grow at a CAGR of 5.5% from 2025 to 2031.

Global key players of UV and non- UV tape for semiconductor include Mitsui Chemicals Tohcello, Nitto Denko, LINTEC Corporation, Furukawa Electric, etc. Global top five manufacturers hold a share over 86%. Asia Pacific is the largest market of UV and non- UV tape for semiconductor holds a share over 55%. In terms of product, UV type is the largest segment, with a share over 60%. And in terms of application, the largest application is wafer dicing, with a share over 62%.

LP Information, Inc. (LPI) ' newest research report, the “UV and Non-UV Tape for Semiconductor Industry Forecast” looks at past sales and reviews total world UV and Non-UV Tape for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected UV and Non-UV Tape for Semiconductor sales for 2025 through 2031. With UV and Non-UV Tape for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world UV and Non-UV Tape for Semiconductor industry.

This Insight Report provides a comprehensive analysis of the global UV and Non-UV Tape for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on UV and Non-UV Tape for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global UV and Non-UV Tape for Semiconductor market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for UV and Non-UV Tape for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global UV and Non-UV Tape for Semiconductor.

This report presents a comprehensive overview, market shares, and growth opportunities of UV and Non-UV Tape for Semiconductor market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
UV Type
Non-UV Type

Segmentation by Application:
Wafer Backing Grinding
Wafer Dicing

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals Tohcello
Nitto Denko
LINTEC Corporation
Furukawa Electric
Denka
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
Maxell Holdings, Ltd
NPMT(NDS)
KGK Chemical Corporation
Nexteck
Taicang Zhanxin Adhesive Material
Taizhou Wisifilm
Suzhou Boyanuvtape
Zhangjiagang Vistaic

Key Questions Addressed in this Report

What is the 10-year outlook for the global UV and Non-UV Tape for Semiconductor market?

What factors are driving UV and Non-UV Tape for Semiconductor market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do UV and Non-UV Tape for Semiconductor market opportunities vary by end market size?

How does UV and Non-UV Tape for Semiconductor break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.