Global Thick-Film Hybrid Integrated Circuits Market Growth 2023-2029

Global Thick-Film Hybrid Integrated Circuits Market Growth 2023-2029

Thick film hybrid integrated circuit (THIC) is a kind of hybrid integrated circuit, which is made of passive network on the same substrate by thick film process such as screen printing and sintering, and then assembled with discrete semiconductor chip or monolithic integrated circuit or micro component, and then packaged. The characteristics of thick film hybrid integrated circuit: compared with discrete component circuit, hybrid integrated circuit has the characteristics of high density, high reliability and better electrical performance; compared with PCB Compared with monolithic integrated circuit, it is flexible in design, simple in process, convenient in production of many varieties and small batch, and has wide parameter range, high precision, and can withstand high voltage and large output In terms of digital circuits, although semiconductor integrated circuits give full play to the characteristics of miniaturization, high reliability and large-scale low-cost production, thick film hybrid integrated circuits still maintain their advantages over semiconductor integrated circuits in many aspects, such as low-noise circuits, high-stability passive networks, high-frequency linear circuits High precision linear circuit, microwave circuit, high-voltage circuit, high-power circuit and mixed analog-to-digital circuit.

LPI (LP Information)' newest research report, the “Thick-Film Hybrid Integrated Circuits Industry Forecast” looks at past sales and reviews total world Thick-Film Hybrid Integrated Circuits sales in 2022, providing a comprehensive analysis by region and market sector of projected Thick-Film Hybrid Integrated Circuits sales for 2023 through 2029. With Thick-Film Hybrid Integrated Circuits sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Thick-Film Hybrid Integrated Circuits industry.

This Insight Report provides a comprehensive analysis of the global Thick-Film Hybrid Integrated Circuits landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Thick-Film Hybrid Integrated Circuits portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Thick-Film Hybrid Integrated Circuits market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Thick-Film Hybrid Integrated Circuits and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Thick-Film Hybrid Integrated Circuits.

The global Thick-Film Hybrid Integrated Circuits market size is projected to grow from US$ 5559.7 million in 2022 to US$ 7866.5 million in 2029; it is expected to grow at a CAGR of 7866.5 from 2023 to 2029.

The main sales regions of thick film hybrid IC are Asia Pacific and North America, which together occupy about 60% of the global market share.

This report presents a comprehensive overview, market shares, and growth opportunities of Thick-Film Hybrid Integrated Circuits market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type

Al2O3 Ceramic Substrate

BeO Ceramic Substrate

Ain Substrate

Others

Segmentation by application

Aviation and National Defense

Automotive Industry

Telecommunication and Computer Industry

Consumer Electronics

Others

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.

International Rectifier (Infineon)

Crane Interpoint

GE Aviation

VPT (HEICO)

MDI

MSK (Anaren)

Technograph Microcircuits

Cermetek Microelectronics

Midas Microelectronics

NAURA Technology Group Co., Ltd.

JRM

International Sensor Systems

Zhenhua Microelectronics Ltd.

Xin Jingchang Electronics Co.,Ltd

E-TekNet

China Electronics Technology Group Corporation

Kolektor Siegert GmbH

Advance Circtuit Technology

AUREL s.p.a.

Fenghua Advanced Technology Holding CO.,LTD,

Custom Interconnect

Integrated Technology Lab

Chongqing Sichuan Instrument Microcircuit Co., Ltd.

Key Questions Addressed in this Report

What is the 10-year outlook for the global Thick-Film Hybrid Integrated Circuits market?

What factors are driving Thick-Film Hybrid Integrated Circuits market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Thick-Film Hybrid Integrated Circuits market opportunities vary by end market size?

How does Thick-Film Hybrid Integrated Circuits break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.