Global Thermally Conductive Adhesives Market Growth 2025-2031

Global Thermally Conductive Adhesives Market Growth 2025-2031

The global Thermally Conductive Adhesives market size is predicted to grow from US$ 81.8 million in 2025 to US$ 110 million in 2031; it is expected to grow at a CAGR of 5.1% from 2025 to 2031.

Shin-Etsu is the world biggest manufacturer of thermally conductive adhesives, followed Dow, Chengdu Guibo Science, etc. The top 5 manufacturers occupy 65% its market share. Asia-Pacific is the largest market, in which holds a market share of around 30%.

LP Information, Inc. (LPI) ' newest research report, the “Thermally Conductive Adhesives Industry Forecast” looks at past sales and reviews total world Thermally Conductive Adhesives sales in 2024, providing a comprehensive analysis by region and market sector of projected Thermally Conductive Adhesives sales for 2025 through 2031. With Thermally Conductive Adhesives sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Thermally Conductive Adhesives industry.

This Insight Report provides a comprehensive analysis of the global Thermally Conductive Adhesives landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Thermally Conductive Adhesives portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Thermally Conductive Adhesives market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Thermally Conductive Adhesives and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Thermally Conductive Adhesives.

This report presents a comprehensive overview, market shares, and growth opportunities of Thermally Conductive Adhesives market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Silicon-based
Non-silicon based

Segmentation by Application:
Telecommunications Equipment
Automotive Electronics
Consumer Electronics
Household Appliances
Power & Industrial
Medical Equipment
Other Applications

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Shin-Etsu
Dow
Henkel
Momentive
Parker Hannifin
Hönle
CHT Group
Chengdu Guibo Science and Technology
3M
Nagase
Sirnice
Shenzhen Dover Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Thermally Conductive Adhesives market?

What factors are driving Thermally Conductive Adhesives market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Thermally Conductive Adhesives market opportunities vary by end market size?

How does Thermally Conductive Adhesives break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.