Global Thermal Conductive Material Market Growth 2025-2031

The global Thermal Conductive Material market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

In China, the key players of thermal conductive material include Jones Tech PLC, Shenzhen FRD Science & Technology and Dow. The top three players hold a share about 22%. In terms of product, HD gap filler is the largest segment, with a share about 40%. And in terms of application, the largest application is semiconductor, with a share about 66%.

LP Information, Inc. (LPI) ' newest research report, the “Thermal Conductive Material Industry Forecast” looks at past sales and reviews total world Thermal Conductive Material sales in 2024, providing a comprehensive analysis by region and market sector of projected Thermal Conductive Material sales for 2025 through 2031. With Thermal Conductive Material sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Thermal Conductive Material industry.

This Insight Report provides a comprehensive analysis of the global Thermal Conductive Material landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Thermal Conductive Material portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Thermal Conductive Material market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Thermal Conductive Material and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Thermal Conductive Material.

This report presents a comprehensive overview, market shares, and growth opportunities of Thermal Conductive Material market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
HD Sheet
HD Paste
HD Adhesive
HD Gap Filler
Others

Segmentation by Application:
LED
Semiconductor
EV Battery
Automotive Electronics
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Dow
Panasonic
Parker Hannifin
Shin-Etsu Chemical
Henkel
Fujipoly
DuPont
Aavid (Boyd Corporation)
3M
Wacker
H.B. Fuller Company
Denka Company Limited
Dexerials Corporation
Tanyuan Technology
Jones Tech PLC
Shenzhen FRD Science & Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Thermal Conductive Material market?

What factors are driving Thermal Conductive Material market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Thermal Conductive Material market opportunities vary by end market size?

How does Thermal Conductive Material break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.