Global Test & Burn-in Socket Market Growth 2025-2031

Global Test & Burn-in Socket Market Growth 2025-2031

The global Test & Burn-in Socket market size is predicted to grow from US$ 1575 million in 2025 to US$ 2428 million in 2031; it is expected to grow at a CAGR of 7.5% from 2025 to 2031.

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

Global key players of Test & Burn-in Socket include Enplas, Cohu, Yamaichi Electronics, Smiths Interconnect, ISC, etc. The top five players hold a share about 41%. North America is the largest market for Test & Burn-in Socket, which has a share about 27%, followed by Japan and South Korea with share 24% and 17%, separately. In terms of product type, Test Socket is the largest segment, occupied for a share of 63%. In terms of application, SOC, CPU, GPU, etc. has a share about 32%.

2021 is a year of great development of the semiconductor industry, due to the unpredictable international situation, repeated epidemics, home economy, online education and training, automotive electronics ushered in comprehensive growth, resulting in continued increase in chip demand. The global COVID-19 pandemic is positively driving demand for the semiconductor industry. Semiconductor manufacturers develop more technologically advanced chips to meet the demands of digitalization. In addition, more and more products are being built with more semiconductors. These results have also led to strong growth in demand for inspection equipment needed to manufacture semiconductors. This in turn promotes the growth of the test aging socket market.

The global semiconductor market turnover declined 8.2% in 2023 to reach $526.9 billion, but is expected to grow 16% in 2024 to reach $611.2 billion, a record high. This growth is mainly due to the completion of supply chain inventory destocking and the booming development of generative AI. In 2024, the AI chip market size is expected to increase by 33% to reach $71.3 billion, further driving the growth of the semiconductor IC market.

Memory market: After a sharp decline in 2023, it is expected to rebound strongly in 2024, and the market turnover will reach $163.153 billion, a significant growth of 76.8% from 2023. Logic IC market: Relatively stable, projected to grow 10.7% in 2024, rising to $196.76 billion. Power semiconductor market: Stable and good, it is expected that the global power semiconductor market will reach $50.3 billion in 2023. As the world's largest consumer of power semiconductors, China's market size is expected to reach $21.2 billion.

Domestic substitution: With the reshaping of the global semiconductor supply chain, the localization process of China's semiconductor industry is accelerating. Domestic enterprises have made breakthroughs in the fields of silicon carbide substrate and 12-inch chemical mechanical polishing equipment. Core equipment breakthrough: Domestic semiconductor equipment and core components have developed rapidly, and continue to catch up and break through in the subdivisions of vacuum valves, ultra-precision motion platforms, and wafer transmission.

LP Information, Inc. (LPI) ' newest research report, the “Test & Burn-in Socket Industry Forecast” looks at past sales and reviews total world Test & Burn-in Socket sales in 2024, providing a comprehensive analysis by region and market sector of projected Test & Burn-in Socket sales for 2025 through 2031. With Test & Burn-in Socket sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Test & Burn-in Socket industry.

This Insight Report provides a comprehensive analysis of the global Test & Burn-in Socket landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Test & Burn-in Socket portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Test & Burn-in Socket market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Test & Burn-in Socket and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Test & Burn-in Socket.

This report presents a comprehensive overview, market shares, and growth opportunities of Test & Burn-in Socket market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Burn-in Socket
Test Socket

Segmentation by Application:
Memory
CMOS Image Sensor
High Voltage
RF
SOC, CPU, GPU, etc.
Other Non-Memory

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Yamaichi Electronics
Cohu
Enplas
ISC
Smiths Interconnect
LEENO
Sensata Technologies
Johnstech
Yokowo
WinWay Technology
Loranger
Plastronics（Smiths）
OKins Electronics
Ironwood Electronics
3M
M Specialties
Aries Electronics
Emulation Technology
Qualmax
MJC
Essai
Rika Denshi
Robson Technologies
Translarity
Test Tooling
Exatron
Gold Technologies
JF Technology
Advanced
Ardent Concepts
TwinSolution

Key Questions Addressed in this Report

What is the 10-year outlook for the global Test & Burn-in Socket market?

What factors are driving Test & Burn-in Socket market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Test & Burn-in Socket market opportunities vary by end market size?

How does Test & Burn-in Socket break out by Type, by Application?