Global Temporary Bonding Adhesive Market Growth 2025-2031

The global Temporary Bonding Adhesive market size is predicted to grow from US$ 224 million in 2025 to US$ 366 million in 2031; it is expected to grow at a CAGR of 8.5% from 2025 to 2031.

Temporary bonding adhesives are specialized adhesives designed to provide a temporary bond between two surfaces, allowing them to be separated later without leaving residue or causing damage. These adhesives are often used in the electronics and semiconductor industries, particularly in processes such as wafer thinning, handling, and packaging. They provide reliable adhesion during critical manufacturing steps and are removed using heat, UV light, or chemical solutions.

Global key players of temporary bonding adhesive include 3M, Daxin Materials, etc. Global top 3 companies hold a share over 40%. Asia Pacific is the largest market, with a share over 70%, followed by Europe and North America with the share about 15% and 10%.

The temporary bonding adhesive market has been gaining momentum, largely due to the growing demand in advanced industries like semiconductors, electronics, and automotive manufacturing. These adhesives are crucial in processes like wafer thinning, chip packaging, and assembly, especially as electronic devices become smaller and more complex. The miniaturization of electronics has driven the need for adhesives that provide reliable yet removable bonds during production. This has led to an increasing focus on high-performance temporary bonding solutions that can handle complex manufacturing processes while enabling efficient debonding without damaging delicate components.

Technological advancements are shaping the temporary bonding adhesive market as manufacturers develop more specialized formulations to meet the stringent requirements of modern industries. For example, in semiconductor manufacturing, temporary adhesives need to withstand extreme conditions such as high temperatures and chemical exposure during processing but must also be easily removed afterward. Innovations in materials, such as UV-curable and heat-resistant adhesives, are helping to expand the application scope of temporary bonding in various industries, enabling faster and more efficient production processes.

The market is also being influenced by sustainability and cost-efficiency trends. Manufacturers are focusing on creating adhesives that are not only effective but also environmentally friendly, aiming to reduce the environmental impact of temporary bonding processes. Recyclable materials and adhesives that can be removed with less energy-intensive methods are gaining attention. However, challenges such as the high cost of specialized adhesives and the need for precise application techniques may limit adoption in cost-sensitive markets. Despite these challenges, the temporary bonding adhesive market is expected to grow steadily, driven by the increasing complexity of modern manufacturing and the need for high-precision, temporary bonding solutions.

LP Information, Inc. (LPI) ' newest research report, the “Temporary Bonding Adhesive Industry Forecast” looks at past sales and reviews total world Temporary Bonding Adhesive sales in 2024, providing a comprehensive analysis by region and market sector of projected Temporary Bonding Adhesive sales for 2025 through 2031. With Temporary Bonding Adhesive sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Temporary Bonding Adhesive industry.

This Insight Report provides a comprehensive analysis of the global Temporary Bonding Adhesive landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Temporary Bonding Adhesive portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Temporary Bonding Adhesive market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Temporary Bonding Adhesive and breaks down the forecast by Debonding Method, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Temporary Bonding Adhesive.

This report presents a comprehensive overview, market shares, and growth opportunities of Temporary Bonding Adhesive market by product type, application, key manufacturers and key regions and countries.

Segmentation by Debonding Method:
Thermal Slide－off Debonding
Mechanical Debonding
Laser Debonding

Segmentation by Application:
MEMS
Advanced Packaging
CMOS
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
3M
Daxin Materials
Brewer Science
AI Technology
YINCAE Advanced Materials
Micro Materials
Promerus
Daetec

Key Questions Addressed in this Report

What is the 10-year outlook for the global Temporary Bonding Adhesive market?

What factors are driving Temporary Bonding Adhesive market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Temporary Bonding Adhesive market opportunities vary by end market size?

How does Temporary Bonding Adhesive break out by Debonding Method, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.