Global Temporary Bonding Adhesive Market Growth 2023-2029

Global Temporary Bonding Adhesive Market Growth 2023-2029

Temporary bonding adhesive can bonded with different surface, This product can be used for backside processes such as fixing, thinning, etching, passivation, electroplating, and reflow soldering of thin wafers below 100μm.
LPI (LP Information)' newest research report, the “Temporary Bonding Adhesive Industry Forecast” looks at past sales and reviews total world Temporary Bonding Adhesive sales in 2022, providing a comprehensive analysis by region and market sector of projected Temporary Bonding Adhesive sales for 2023 through 2029. With Temporary Bonding Adhesive sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Temporary Bonding Adhesive industry.
This Insight Report provides a comprehensive analysis of the global Temporary Bonding Adhesive landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Temporary Bonding Adhesive portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Temporary Bonding Adhesive market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Temporary Bonding Adhesive and breaks down the forecast by debonding method, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Temporary Bonding Adhesive.
The global Temporary Bonding Adhesive market size is projected to grow from US$ 191.6 million in 2022 to US$ 339.4 million in 2029; it is expected to grow at a CAGR of 339.4 from 2023 to 2029.
Global key players of temporary bonding adhesive include 3M, Daxin Materials, etc. Global top 3 companies hold a share over 40%. Asia Pacific is the largest market, with a share over 70%, followed by Europe and North America with the share about 15% and 10%. In terms of product, thermal slide－off debonding is the largest segment, with a share over 50%. And in terms of application, the largest application is MEMS, with a share about 40%.
This report presents a comprehensive overview, market shares, and growth opportunities of Temporary Bonding Adhesive market by product debonding method, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by debonding method
Thermal Slide－off Debonding
Mechanical Debonding
Laser Debonding
Segmentation by application
MEMS
Advanced Packaging
CMOS
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
3M
Daxin Materials
Brewer Science
AI Technology
YINCAE Advanced Materials
Micro Materials
Promerus
Daetec

Key Questions Addressed in this Report
What is the 10-year outlook for the global Temporary Bonding Adhesive market?
What factors are driving Temporary Bonding Adhesive market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Temporary Bonding Adhesive market opportunities vary by end market size?
How does Temporary Bonding Adhesive break out debonding method, application?
What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.