Global Tape for Dicing Market Growth 2023-2029

Global Tape for Dicing Market Growth 2023-2029

The global Tape for Dicing market size is projected to grow from US$ 9782.5 million in 2022 to US$ 15450 million in 2029; it is expected to grow at a CAGR of 6.7% from 2023 to 2029.

United States market for Tape for Dicing is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

China market for Tape for Dicing is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Europe market for Tape for Dicing is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Global key Tape for Dicing players cover Nitto Denko Corp, Mitsui Chemicals Inc., Sumitomo Bakelite Co. Ltd., AI Technology, Inc., LINTEC Corporation, Denka Company Limited, Ultron Systems Inc., Pantech Tape Co. Ltd. and QES GROUP BERHAD, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.

Tape for Dicing is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication. The tape holds the pieces of the substrate, in case of a wafer called as die, together during the cutting process, mounting them to a thin metal frame. The dies/substrate pieces are removed from the dicing tape later on in the electronics manufacturing process.

LPI (LP Information)' newest research report, the “Tape for Dicing Industry Forecast” looks at past sales and reviews total world Tape for Dicing sales in 2022, providing a comprehensive analysis by region and market sector of projected Tape for Dicing sales for 2023 through 2029. With Tape for Dicing sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Tape for Dicing industry.

This Insight Report provides a comprehensive analysis of the global Tape for Dicing landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Tape for Dicing portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Tape for Dicing market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Tape for Dicing and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Tape for Dicing.

This report presents a comprehensive overview, market shares, and growth opportunities of Tape for Dicing market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
UV Tapes
Thermal Release Tapes

Segmentation by application
Wafer Manufacturing
Package
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Nitto Denko Corp
Mitsui Chemicals Inc.
Sumitomo Bakelite Co. Ltd.
AI Technology, Inc.
LINTEC Corporation
Denka Company Limited
Ultron Systems Inc.
Pantech Tape Co. Ltd.
QES GROUP BERHAD
Nippon Pulse Motor
Loadpoint Limited
Daest Coating India Pvt. Ltd.
Shenzhen Xinst Technology Co. Ltd.
Solar Plus Company

Key Questions Addressed in this Report

What is the 10-year outlook for the global Tape for Dicing market?

What factors are driving Tape for Dicing market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Tape for Dicing market opportunities vary by end market size?

How does Tape for Dicing break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: the online download version of this report is for a global site license.