Global Storage Device PCB Market Growth 2024-2030
The global Storage Device PCB market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
LP Information, Inc. (LPI) ' newest research report, the “Storage Device PCB Industry Forecast” looks at past sales and reviews total world Storage Device PCB sales in 2023, providing a comprehensive analysis by region and market sector of projected Storage Device PCB sales for 2024 through 2030. With Storage Device PCB sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Storage Device PCB industry.
This Insight Report provides a comprehensive analysis of the global Storage Device PCB landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Storage Device PCB portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Storage Device PCB market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Storage Device PCB and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Storage Device PCB.
United States market for Storage Device PCB is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Storage Device PCB is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Storage Device PCB is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Storage Device PCB players cover Zhen Ding Technology, Unimicron, DSBJ (Dongshan Precision), Nippon Mektron, TTM Technologies, Inc, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Storage Device PCB market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
14-16 Layers PCB
18-20 Layers PCB
Others
Segmentation by Application:
Hard Disk Drive
Solid State Drive
Memory Module
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Zhen Ding Technology
Unimicron
DSBJ (Dongshan Precision)
Nippon Mektron
TTM Technologies, Inc
Compeq Manufacturing
Tripod Technology
Kinwong
Shennan Circuit
Ibiden
Nan Ya PCB
Kingboard Holdings
AT&S
Dynamic Electronics
Key Questions Addressed in this Report
What is the 10-year outlook for the global Storage Device PCB market?
What factors are driving Storage Device PCB market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Storage Device PCB market opportunities vary by end market size?
How does Storage Device PCB break out by Type, by Application?
Please note: The report will take approximately 2 business days to prepare and deliver.