Global Soldering-type Conductive Paste Market Growth 2023-2029

Global Soldering-type Conductive Paste Market Growth 2023-2029

Soldering-type conductive paste, also known as power compound grease, is a new type of electrical material, which can be used for the contact surface of power connectors, and has significant effects of reducing resistance, anti-corrosion and power saving. Our country has been developing and producing since the 1980s. There are dozens of varieties and models, and their basic performance is the same. Mineral oil, synthetic lipid oil, and silicone oil are used as base oils, and special additives such as electrical conductivity, anti-oxidation, anti-corrosion, and arc suppression are added. Soft paste made by grinding, dispersing, modifying and refining. Conductive adhesives are typically heat-cured epoxy or UV-cured acrylate adhesives, with the addition of metallic fillers, such as silver, to achieve conductivity. Adhesive conductive adhesives are often used as a more effective alternative to traditional bonding. Since adhesive conductive adhesives cure at significantly lower temperatures than solder, this adhesive is ideal for making conductive connections in heat-sensitive materials. In addition, such glues are more flexible than solder and therefore better resistant to vibration. Compared with solder, the advantage of adhesive conductive adhesive is that it is lead-free and solvent-free.

LPI (LP Information)' newest research report, the “Soldering-type Conductive Paste Industry Forecast” looks at past sales and reviews total world Soldering-type Conductive Paste sales in 2022, providing a comprehensive analysis by region and market sector of projected Soldering-type Conductive Paste sales for 2023 through 2029. With Soldering-type Conductive Paste sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Soldering-type Conductive Paste industry.

This Insight Report provides a comprehensive analysis of the global Soldering-type Conductive Paste landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Soldering-type Conductive Paste portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Soldering-type Conductive Paste market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Soldering-type Conductive Paste and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Soldering-type Conductive Paste.

The global Soldering-type Conductive Paste market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.

United States market for Soldering-type Conductive Paste is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

China market for Soldering-type Conductive Paste is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Europe market for Soldering-type Conductive Paste is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Global key Soldering-type Conductive Paste players cover NAMICS Corporation, Dycotec Materials Ltd., MITSUBOSHI, Henkel, CollTech, Yi Kun Glue, Darbond, Dover and Polychem UV/EB International Corp., etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.

This report presents a comprehensive overview, market shares, and growth opportunities of Soldering-type Conductive Paste market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
Silver Conductive Paste
Copper Conductive Paste
Gold Conductive Paste

Segmentation by application
Electronic Component
Ceramic Capacitor
Battery Material
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
NAMICS Corporation
Dycotec Materials Ltd.
MITSUBOSHI
Henkel
CollTech
Yi Kun Glue
Darbond
Dover
Polychem UV/EB International Corp.
MG Chemicals
NTP
Diagnosys
Electron Microscopy Sciences
Parker Lord
PELNOX

Key Questions Addressed in this Report

What is the 10-year outlook for the global Soldering-type Conductive Paste market?

What factors are driving Soldering-type Conductive Paste market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Soldering-type Conductive Paste market opportunities vary by end market size?

How does Soldering-type Conductive Paste break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.