Global Solder Ball Market Growth 2025-2031

Global Solder Ball Market Growth 2025-2031


The global Solder Ball market size is predicted to grow from US$ 280 million in 2025 to US$ 414 million in 2031; it is expected to grow at a CAGR of 6.7% from 2025 to 2031.

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

The Solder Ball industry can be broken down into several segments, Lead Solder Ball and Lead Free Solder Ball.

Across the world, the major players cover Senju Metal, DS HiMetal, etc.

Asia Pacific held the leading share of the market in terms of revenue. We estimate that the global market share of Solder Ball is 27% in Taiwan, 20% in Korea, 17% in Japan, 15% in China and 10% in South East Asia.

Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market. Senju Metal dominated with 40% revenue share, followed by DS HiMetal with 19% revenue share and MKE with 7% revenue share.

LP Information, Inc. (LPI) ' newest research report, the “Solder Ball Industry Forecast” looks at past sales and reviews total world Solder Ball sales in 2024, providing a comprehensive analysis by region and market sector of projected Solder Ball sales for 2025 through 2031. With Solder Ball sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Solder Ball industry.

This Insight Report provides a comprehensive analysis of the global Solder Ball landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Solder Ball portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Solder Ball market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Solder Ball and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Solder Ball.

This report presents a comprehensive overview, market shares, and growth opportunities of Solder Ball market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Lead Solder Ball
Lead Free Solder Ball

Segmentation by Application:
BGA
CSP & WLCSP
Flip-Chip & Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material

Key Questions Addressed in this Report

What is the 10-year outlook for the global Solder Ball market?

What factors are driving Solder Ball market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Solder Ball market opportunities vary by end market size?

How does Solder Ball break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.


*This is a tentative TOC and the final deliverable is subject to change.*
1 Scope of the Report
2 Executive Summary
3 Global by Company
4 World Historic Review for Solder Ball by Geographic Region
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
9 Market Drivers, Challenges and Trends
10 Manufacturing Cost Structure Analysis
11 Marketing, Distributors and Customer
12 World Forecast Review for Solder Ball by Geographic Region
13 Key Players Analysis
14 Research Findings and Conclusion

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