Global Silver Powder and Paste for Electronic Components Market Growth 2023-2029
The global Silver Powder and Paste for Electronic Components market size is projected to grow from US$ 562.5 million in 2022 to US$ 655.5 million in 2029; it is expected to grow at a CAGR of 655.5 from 2023 to 2029.
The key manufacturers of Silver Powder and Paste for Electronic Components in the world are Shoei Chemical, Heraeus, CNMC Ningxia Orient Group, Mitsui Kinzoku, Changgui Metal Powder, Kunming Noble Metal Electronic Materials, Fukuda and Tongling Nonferrous Metals Group Holding, among which the market share of the top five manufacturers is more than 50%, and the largest manufacturer is Shoei Chemical. The production of silver powder and paste for electronic components in the world is mainly distributed in North America, Europe, China and Japan, among which the top three production regions account for more than 70% of the market share, and China is currently the largest production region. For its products, the growth rate of product with the average particle size is less than 1.0 μm is relatively fast, and the market share of the average particle size is 1.0 μm to 5.0 μm is the highest, more than 50%, followed by the average particle size greater than 5.0 μm products. In terms of its application, IC is the largest field of application, with a market share of nearly 50%, followed by capacitors, resistors and thin membrane switch.
LPI (LP Information)' newest research report, the “Silver Powder and Paste for Electronic Components Industry Forecast” looks at past sales and reviews total world Silver Powder and Paste for Electronic Components sales in 2022, providing a comprehensive analysis by region and market sector of projected Silver Powder and Paste for Electronic Components sales for 2023 through 2029. With Silver Powder and Paste for Electronic Components sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Silver Powder and Paste for Electronic Components industry.
This Insight Report provides a comprehensive analysis of the global Silver Powder and Paste for Electronic Components landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Silver Powder and Paste for Electronic Components portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Silver Powder and Paste for Electronic Components market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Silver Powder and Paste for Electronic Components and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Silver Powder and Paste for Electronic Components.
This report presents a comprehensive overview, market shares, and growth opportunities of Silver Powder and Paste for Electronic Components market by product type, application, key manufacturers and key regions and countries.
Market Segmentation:
Segmentation by type
Average Particle Size: Below 1.0 μm
Average Particle Size: 1.0 μm-5.0 μm
Average Particle Size: Above 5.0 μm
Segmentation by application
IC
Capacitor
Resistor
Membrane Switch
Ohers
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Shoei Chemical
Heraeus
CNMC Ningxia Orient Group
Mitsui Kinzoku
Changgui Metal Powder
Kunming Noble Metal Electronic Materials
Fukuda
Tongling Nonferrous Metals Group Holding
Ningbo Jingxin Electronic Material
Ames Goldsmith
Shin Nihon Kakin
Technic
AG PRO Technology
Jiangsu Boqian New Materials Stock
Ling Guang
Key Questions Addressed in this Report
What is the 10-year outlook for the global Silver Powder and Paste for Electronic Components market?
What factors are driving Silver Powder and Paste for Electronic Components market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Silver Powder and Paste for Electronic Components market opportunities vary by end market size?
How does Silver Powder and Paste for Electronic Components break out type, application?
What are the influences of COVID-19 and Russia-Ukraine war?
Please note: The report will take approximately 2 business days to prepare and deliver.
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