Global Through-Silicon Vias (TSVs) Market Growth (Status and Outlook) 2025-2031

The global Through-Silicon Vias (TSVs) market size is predicted to grow from US$ 3434 million in 2025 to US$ 7960 million in 2031; it is expected to grow at a CAGR of 15.0% from 2025 to 2031.

Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.

At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 25% of the global market. Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. These major enterprises account for more than 80% of the total share.

The global Through-Silicon Vias (TSVs) market is poised for significant growth due to the rising demand for high-performance, compact, and energy-efficient electronic devices. TSV technology is a critical enabler of 3D integrated circuits (ICs) and advanced packaging solutions, making it essential for applications like artificial intelligence (AI), 5G, automotive electronics, and high-performance computing (HPC).

Market Growth Drivers

Demand for 3D Integration:

TSVs enable vertical stacking of chips, reducing the interconnect length and enhancing performance, making them indispensable for 3D ICs and heterogeneous integration.

Applications in logic-memory integration, MEMS, and CMOS image sensors are key contributors.

Proliferation of AI and 5G:

TSVs are critical for high-bandwidth memory (HBM), used in AI accelerators and 5G base stations.

These technologies require higher data transfer rates, lower latency, and reduced power consumption, driving TSV adoption.

Miniaturization and High-Density Packaging:

The trend towards smaller, lighter, and more functional devices necessitates the use of TSVs for high-density interconnects.

Growth in Automotive Electronics:

The demand for advanced driver-assistance systems (ADAS), autonomous driving, and in-vehicle sensors is spurring the adoption of TSV-enabled components.

Expansion in Data Centers and HPC:

High-performance TSV-based packaging solutions are essential for the increasing processing power demands in cloud computing and data centers.



LPI (LP Information)' newest research report, the “Through-Silicon Vias (TSVs) Industry Forecast” looks at past sales and reviews total world Through-Silicon Vias (TSVs) sales in 2024, providing a comprehensive analysis by region and market sector of projected Through-Silicon Vias (TSVs) sales for 2025 through 2031. With Through-Silicon Vias (TSVs) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Through-Silicon Vias (TSVs) industry.

This Insight Report provides a comprehensive analysis of the global Through-Silicon Vias (TSVs) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Through-Silicon Vias (TSVs) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Through-Silicon Vias (TSVs) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Through-Silicon Vias (TSVs) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Through-Silicon Vias (TSVs).

This report presents a comprehensive overview, market shares, and growth opportunities of Through-Silicon Vias (TSVs) market by product type, application, key players and key regions and countries.

Segmentation by Type:
2.5D TSV
3D TSV

Segmentation by Application:
Mobile and Consumer Electronics
Communication Equipment
Automotive Electronics
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE Technology Holding
Amkor Technology
TSMC
Intel
GlobalFoundries
JCET Group
Samsung
HT-tech

Please note: The report will take approximately 2 business days to prepare and deliver.