Global Through-Silicon Vias (TSVs) Market Growth (Status and Outlook) 2023-2029

Global Through-Silicon Vias (TSVs) Market Growth (Status and Outlook) 2023-2029

Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.
LPI (LP Information)' newest research report, the “Through-Silicon Vias (TSVs) Industry Forecast” looks at past sales and reviews total world Through-Silicon Vias (TSVs) sales in 2022, providing a comprehensive analysis by region and market sector of projected Through-Silicon Vias (TSVs) sales for 2023 through 2029. With Through-Silicon Vias (TSVs) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Through-Silicon Vias (TSVs) industry.
This Insight Report provides a comprehensive analysis of the global Through-Silicon Vias (TSVs) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Through-Silicon Vias (TSVs) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Through-Silicon Vias (TSVs) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Through-Silicon Vias (TSVs) and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Through-Silicon Vias (TSVs).
The global Through-Silicon Vias (TSVs) market size is projected to grow from US$ 1757 million in 2022 to US$ 7765.9 million in 2029; it is expected to grow at a CAGR of 23.7% from 2023 to 2029.
At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 24% of the global market in 2019.
Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. In 2019, These major enterprises account for more than 80% of the total share.
This report presents a comprehensive overview, market shares, and growth opportunities of Through-Silicon Vias (TSVs) market by product type, application, key players and key regions and countries.
Market Segmentation:
Segmentation by type
2.5D Through-Silicon Vias
3D Through-Silicon Vias
Segmentation by application
Mobile And Consumer Electronics
Communication Equipment
Automotive And Transportation Electronics
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE Technology Holding
Amkor Technology
Taiwan Semiconductor Manufacturing Company Limited
Intel Corporation
GLOBALFOUNDRIES
JCET Group
Samsung
Tianshui Huatian Technology

Please note: The report will take approximately 2 business days to prepare and deliver.