Global Silicon Photonics Packaging Market Growth (Status and Outlook) 2025-2031

The global Silicon Photonics Packaging market size is predicted to grow from US$ 1006 million in 2025 to US$ 2086 million in 2031; it is expected to grow at a CAGR of 12.9% from 2025 to 2031.

Silicon photonic packaging is a technical service that protects the performance of silicon photonic chips and improves chip reliability and stability. It realizes the mutual conversion and processing of photoelectric signals by integrating photonic devices and electronic devices on the same chip. The development trend of silicon photonic chip packaging technology is to develop in the direction of smaller, lighter and thinner to meet the needs of various application scenarios.

United States market for Silicon Photonics Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Silicon Photonics Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Silicon Photonics Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Silicon Photonics Packaging players cover TSMC, Kulicke & Soffa, GlobalFoundries, PI Americas, PLCC2 LLC, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LPI (LP Information)' newest research report, the “Silicon Photonics Packaging Industry Forecast” looks at past sales and reviews total world Silicon Photonics Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Silicon Photonics Packaging sales for 2025 through 2031. With Silicon Photonics Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Silicon Photonics Packaging industry.

This Insight Report provides a comprehensive analysis of the global Silicon Photonics Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Silicon Photonics Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Silicon Photonics Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Silicon Photonics Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Silicon Photonics Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Silicon Photonics Packaging market by product type, application, key players and key regions and countries.

Segmentation by Type:
Chip-level Packaging
Module-level Packaging
System-level Packaging

Segmentation by Application:
Optical Communications
Semiconductors
Defense and Aerospace
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
TSMC
Kulicke & Soffa
GlobalFoundries
PI Americas
PLCC2 LLC
AIM Photonics
Jabil AOC Technologies
Broadex Technologies

Please note: The report will take approximately 2 business days to prepare and deliver.