Global SiC Wafer Thinning Equipment Market Growth 2025-2031

The global SiC Wafer Thinning Equipment market size is predicted to grow from US$ 111 million in 2025 to US$ 296 million in 2031; it is expected to grow at a CAGR of 17.7% from 2025 to 2031.

Global key players of SiC Wafer Thinning Equipment include Disco, TSD, TOKYO SEIMITSU, Engis Corporation, Okamoto, etc. The top five players hold a share about 82%. China is the largest market for SiC Wafer Thinning Equipment and has a share about 36%, followed by North America and Japan, with share 32% and 12%, separately. In terms of product type, Full-Automatic is the largest segment, occupied for a share of 77%. In terms of application, 6 inches and Below is the largest application, occupied for a share of 72%.

LP Information, Inc. (LPI) ' newest research report, the “SiC Wafer Thinning Equipment Industry Forecast” looks at past sales and reviews total world SiC Wafer Thinning Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected SiC Wafer Thinning Equipment sales for 2025 through 2031. With SiC Wafer Thinning Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world SiC Wafer Thinning Equipment industry.

This Insight Report provides a comprehensive analysis of the global SiC Wafer Thinning Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on SiC Wafer Thinning Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global SiC Wafer Thinning Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for SiC Wafer Thinning Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global SiC Wafer Thinning Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of SiC Wafer Thinning Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

Full-Automatic

Semi-Automatic

Segmentation by Application:

6 inches and Below

6 Inch and Above

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

Disco

TSD

TOKYO SEIMITSU

Engis Corporation

Okamoto Semiconductor Equipment Division

Revasum

Koyo Machinery

G&N

Key Questions Addressed in this Report

What is the 10-year outlook for the global SiC Wafer Thinning Equipment market?

What factors are driving SiC Wafer Thinning Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do SiC Wafer Thinning Equipment market opportunities vary by end market size?

How does SiC Wafer Thinning Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.