Global SiC Wafer Processing Equipment Market Growth (Status and Outlook) 2024-2030

Global SiC Wafer Processing Equipment Market Growth (Status and Outlook) 2024-2030

Silicon carbide MOSFETs have the characteristics of low on-resistance and small switching losses, which can reduce device losses and improve system efficiency, and are more suitable for high-frequency circuits. It is widely used in the fields of new energy vehicle motor controller, vehicle power supply, solar inverter, charging pile, UPS, PFC power supply and other fields.

This report studies the Silicon carbide (SiC) wafer processing equipment.

The global SiC Wafer Processing Equipment market size is projected to grow from US$ 4876 million in 2024 to US$ 15580 million in 2030; it is expected to grow at a CAGR of 21.4% from 2024 to 2030.

LPI (LP Information)' newest research report, the “SiC Wafer Processing Equipment Industry Forecast” looks at past sales and reviews total world SiC Wafer Processing Equipment sales in 2022, providing a comprehensive analysis by region and market sector of projected SiC Wafer Processing Equipment sales for 2023 through 2029. With SiC Wafer Processing Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world SiC Wafer Processing Equipment industry.

This Insight Report provides a comprehensive analysis of the global SiC Wafer Processing Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on SiC Wafer Processing Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global SiC Wafer Processing Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for SiC Wafer Processing Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global SiC Wafer Processing Equipment.

United States market for SiC Wafer Processing Equipment is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

China market for SiC Wafer Processing Equipment is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Europe market for SiC Wafer Processing Equipment is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.

Global key SiC Wafer Processing Equipment players cover Applied Materials, ACCRETECH, Engis, Revasum, DISCO, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2023.

This report presents a comprehensive overview, market shares, and growth opportunities of SiC Wafer Processing Equipment market by product type, application, key players and key regions and countries.

Segmentation by Type:
SiC Thinning and CMP
SiC Deposition Equipment
SiC Epitaxy/HTCVD Equipment
SiC Thermal Processing Equipment
SiC Etch and Clean Equipment
SiC Ion Implant
SiC Patterning Equipment
SiC Metrology and Inspection Equipment
SiC Wafer Bonders

Segmentation by Application:
SiC Substrate Processing
SiC Epitaxy Processing
SiC Devices Fabrication

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

Segmentation by Type:
SiC Thinning and CMP
SiC Deposition Equipment
SiC Epitaxy/HTCVD Equipment
SiC Thermal Processing Equipment
SiC Etch and Clean Equipment
SiC Ion Implant
SiC Patterning Equipment
SiC Metrology and Inspection Equipment
SiC Wafer Bonders

Segmentation by Application:
SiC Substrate Processing
SiC Epitaxy Processing
SiC Devices Fabrication

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Applied Materials
ACCRETECH
Engis
Revasum
DISCO
Wolfspeed
SiCrystal
II-VI Advanced Materials
TankeBlue
PVA Tepla
Materials Research Furnaces
Aymont
Takatori
Meyer Burger
Komatsu NTC
KLA Corporation
Lasertec
Aixtron
LPE Epitaxial Technology
VEECO
AMEC
NuFlare Technology Inc.
Taiyo Nippon Sanso
ASM International N.V
Naura
Logitech
3D-Micromac
Synova S.A.
Visiontec Group
Nanotronics
TASMIT, Inc. (Toray Engineering)
Angkun Vision (Beijing) Technology
Beijing TSD Semiconductor Co., Ltd.
Zhejiang Jingsheng Mechanical & Electrical
Shanxi Semisic Crystal Co., Ltd.
Shenzhen Naso Tech Co., Ltd.
TDG Holding
Xin San Dai Semiconductor Technology
PNC Technology Group
Hebei arashi whale photoelectric technology
Nanjing Jingsheng Equipment
Beijing Jingyuntong Technology

Please note: The report will take approximately 2 business days to prepare and deliver.