Global SiC Wafer Laser Cutting Equipment Market Growth 2023-2029

Global SiC Wafer Laser Cutting Equipment Market Growth 2023-2029

The global SiC Wafer Laser Cutting Equipment market size is projected to grow from US$ 89 million in 2022 to US$ 265.2 million in 2029; it is expected to grow at a CAGR of 16.9% from 2023 to 2029.

Global key players of SiC wafer laser cutting equipment include DISCO Corporation, SuZhou Delphi Laser and Han's Laser, etc. The top three players hold a share over 60%.From the perspective of consumption value by region，Asia-Pacific (excluding China) is the largest market of SiC wafer laser cutting equipment, followed by China, North America, and Europe. In terms of type, processing sizes up to 6 Inches account for more than 75% of the market share. In terms of application, foundry has a share over 60 %.

Silicon carbide (SiC) was discovered in 1893 as an industrial abrasive for grinding wheels and automotive brakes. The scheme of laser cutting silicon carbide is laser modified cutting technology. The principle is to use a laser beam with a high transmission wavelength to focus on the inside of the wafer through a lens, and multiphoton absorption occurs, resulting in a local deformation layer, namely modified layer. The layer is mainly composed of holes, high dislocation density layers and cracks. The modified layer is the starting point of subsequent wafer dicing and cracking. The modified layer can be confined inside the wafer by optimizing the laser and optical path system, and no thermal damage is caused to the surface and bottom of the wafer. Then, use external force to guide the cracks to the surface and bottom of the wafer, separating the wafer into the required size.

LPI (LP Information)' newest research report, the “SiC Wafer Laser Cutting Equipment Industry Forecast” looks at past sales and reviews total world SiC Wafer Laser Cutting Equipment sales in 2022, providing a comprehensive analysis by region and market sector of projected SiC Wafer Laser Cutting Equipment sales for 2023 through 2029. With SiC Wafer Laser Cutting Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world SiC Wafer Laser Cutting Equipment industry.

This Insight Report provides a comprehensive analysis of the global SiC Wafer Laser Cutting Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on SiC Wafer Laser Cutting Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global SiC Wafer Laser Cutting Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for SiC Wafer Laser Cutting Equipment and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global SiC Wafer Laser Cutting Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of SiC Wafer Laser Cutting Equipment market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
Processing Sizes up to 6 Inches
Processing Sizes up to 8 Inches

Segmentation by application
Foundry
IDM

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
DISCO Corporation
Suzhou Delphi Laser Co
Han's Laser Technology
3D-Micromac
Synova S.A.
HGTECH
ASMPT
GHN.GIE
Wuhan DR Laser Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global SiC Wafer Laser Cutting Equipment market?

What factors are driving SiC Wafer Laser Cutting Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do SiC Wafer Laser Cutting Equipment market opportunities vary by end market size?

How does SiC Wafer Laser Cutting Equipment break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.