Global SiC & GaN Wafer Defect Inspection System Market Growth 2024-2030
Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it's becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of applications, particularly battery-electric vehicles. So SiC device makers will need to bolster their process control measures with more inspection and metrology in the fab. Fortunately, the inspection and metrology equipment for SiC has recently become available, but these tools add cost to the fab equation. Generally, inspection systems locate defects on the wafer, while metrology tools characterize the structures in devices. Both technologies are used to pinpoint problems and ensure yields for all chip types. SiC, a compound semiconductor material based on silicon and carbon, is used to make specialized power semiconductors for high-voltage applications, such as electric vehicles, power supplies and solar inverters. SiC has several advantages over conventional silicon-based power semis like IGBTs and power MOSFETs. But the silicon-based solutions dominate the market because they are less expensive than SiC. In recent times, SiC device makers completed a difficult transition from 100mm (4-inch) to 150mm (6-inch) wafers to 200mm (8-inch) in the fab. Some vendors, though, are still struggling with their yields and defect levels at 150mm. A few vendors have overcome most of these challenges, however. Amid the challenges in the market, SiC device makers are now seeing an increase in demand for battery-electric cars. For years, SiC vendors have served the automotive market to a limited degree. But for next-generation electric vehicles, the industry will need to bring the technology to the next level and meet the industry's rigid reliability, defect and cost specs.
The global SiC & GaN Wafer Defect Inspection System market size is projected to grow from US$ 1019 million in 2024 to US$ 2990 million in 2030; it is expected to grow at a CAGR of 19.6% from 2024 to 2030.
LP Information, Inc. (LPI) ' newest research report, the “SiC & GaN Wafer Defect Inspection System Industry Forecast” looks at past sales and reviews total world SiC & GaN Wafer Defect Inspection System sales in 2023, providing a comprehensive analysis by region and market sector of projected SiC & GaN Wafer Defect Inspection System sales for 2024 through 2030. With SiC & GaN Wafer Defect Inspection System sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world SiC & GaN Wafer Defect Inspection System industry.
This Insight Report provides a comprehensive analysis of the global SiC & GaN Wafer Defect Inspection System landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on SiC & GaN Wafer Defect Inspection System portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global SiC & GaN Wafer Defect Inspection System market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for SiC & GaN Wafer Defect Inspection System and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global SiC & GaN Wafer Defect Inspection System.
Global key players of SiC Wafer Defect Inspection System include KLA Corporation, Lasertec, Bruker, Visiontec Group, TASMIT, Inc., etc. The top five players hold a share about 95%. North America is the largest market, and has a share about 32%, followed by Europe and Japan with share 27% and 15%, separately. In terms of product type, Optical Inspection System is the largest segment, occupied for a share of 97%. In terms of application, SiC Substrate has a share about 73 percent.
This report presents a comprehensive overview, market shares, and growth opportunities of SiC & GaN Wafer Defect Inspection System market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Optical Inspection System
X-ray Diffraction Imaging (XRDI) System
Segmentation by Application:
SiC Substrate, Epitaxy and Devices
GaN Substrate, Epitaxy and Devices
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
KLA Corporation
Lasertec
Visiontec Group
Nanotronics
TASMIT, Inc.
Bruker
LAZIN CO.,LTD
EtaMax
Spirox Corporation
Angkun Vision (Beijing) Technology
Shenzhen Glint Vision
CETC Fenghua Information Equipment
CASI Vision Technology (Luoyang) Co., Ltd
Shanghai Youruipu Semiconductor Equipment
Dalian Chuangrui Spectral Technology Co., Ltd
T-Vision.AI (Hangzhou) Tech Co.,Ltd.
HGTECH
Key Questions Addressed in this Report
What is the 10-year outlook for the global SiC & GaN Wafer Defect Inspection System market?
What factors are driving SiC & GaN Wafer Defect Inspection System market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do SiC & GaN Wafer Defect Inspection System market opportunities vary by end market size?
How does SiC & GaN Wafer Defect Inspection System break out by Type, by Application?
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