Global Si Wafer Thinning Equipment Market Growth 2025-2031

The global Si Wafer Thinning Equipment market size is predicted to grow from US$ 979 million in 2025 to US$ 1451 million in 2031; it is expected to grow at a CAGR of 6.8% from 2025 to 2031.

Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

LP Information, Inc. (LPI) ' newest research report, the “Si Wafer Thinning Equipment Industry Forecast” looks at past sales and reviews total world Si Wafer Thinning Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Si Wafer Thinning Equipment sales for 2025 through 2031. With Si Wafer Thinning Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Si Wafer Thinning Equipment industry.

This Insight Report provides a comprehensive analysis of the global Si Wafer Thinning Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Si Wafer Thinning Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Si Wafer Thinning Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Si Wafer Thinning Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Si Wafer Thinning Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Si Wafer Thinning Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Full-Automatic
Semi-Automatic

Segmentation by Application:
200 mm Wafer
300 mm Wafer
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke

Key Questions Addressed in this Report

What is the 10-year outlook for the global Si Wafer Thinning Equipment market?

What factors are driving Si Wafer Thinning Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Si Wafer Thinning Equipment market opportunities vary by end market size?

How does Si Wafer Thinning Equipment break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.