Global Semiconductor Wafer Tape Market Growth 2023-2029

Global Semiconductor Wafer Tape Market Growth 2023-2029

The global Semiconductor Wafer Tape market size is projected to grow from US$ 1192.3 million in 2022 to US$ 1807.1 million in 2029; it is expected to grow at a CAGR of 6.1% from 2023 to 2029.

The key manufacturers of Semiconductor Wafer Tape in the world are Mitsui Chemicals, LINTEC, Denka, Nitto, 3M, The Furukawa Electric, Sekisui Chemical, Resonac Corporation, and Sumitomo Bakelite Company, among which the top three manufacturers have a market share of over 50%. Currently, the largest manufacturer is Mitsui Chemicals. The production of semiconductor wafer tape worldwide is mainly concentrated in regions such as North America, Europe, and China, with the top three production regions accounting for over 90% of the market share, with North America being the largest production region. In terms of its product category, the growth rate of dicing tape is relatively high, and the market share is the highest, exceeding 60%, followed by back grinding tape and mold release tape. In terms of its application, wafer cutting is the largest application field, with a market share of nearly 60%, followed by wafer grinding and cleaning, packaging and masking, and acid etching.

Semiconductor wafer adhesive tape, also known as wafer scribing adhesive tape or simply referred to as wafer scribing adhesive tape, is a special adhesive tape used in the semiconductor industry to fix fine silicon wafers in place during the scribing process. One side of the adhesive tape has a strong adhesive that firmly adheres to the surface of the wafer, while the other side is typically made of a polymer film that provides support and stability during the scribing process. In semiconductor manufacturing, silicon wafers are typically divided into individual microchips through a process called scribing. The wafer is first coated with a photoresist, and then exposed to ultraviolet light through a photomask to form a circuit pattern on the wafer. The exposed area of the photoresist is then chemically etched away, leaving a circuit pattern on the wafer surface. A dedicated saw is then used to cut the wafer along these patterns into individual microchips. Semiconductor wafer tape is used to hold the wafers together during the scribing process to prevent them from cracking or breaking. After scribing is complete, remove the tape, and clean and package the individual microchips for use in electronic devices.

LPI (LP Information)' newest research report, the “Semiconductor Wafer Tape Industry Forecast” looks at past sales and reviews total world Semiconductor Wafer Tape sales in 2022, providing a comprehensive analysis by region and market sector of projected Semiconductor Wafer Tape sales for 2023 through 2029. With Semiconductor Wafer Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Wafer Tape industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Wafer Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Wafer Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Semiconductor Wafer Tape market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Wafer Tape and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Wafer Tape.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Wafer Tape market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
Back Grinding Tape
Mold Release Tape
Dicing Tape

Segmentation by application
Wafer Grinding and Cleaning
Wafer Cutting
Packaging and Masking
Acid Etching

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Mitsui Chemicals
LINTEC
Denka
Nitto
3M
The Furukawa Electric
Sekisui Chemical
Resonac Corporation
Sumitomo Bakelite Company
Maxell Sliontec
Plusco Tech
KGK Chemical Corporation

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Wafer Tape market?

What factors are driving Semiconductor Wafer Tape market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Wafer Tape market opportunities vary by end market size?

How does Semiconductor Wafer Tape break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.