Global Semiconductor Wafer Dicing Machine Market Growth 2025-2031

The global Semiconductor Wafer Dicing Machine market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

The semiconductor wafer dicing machine divides the wafer containing many chips into wafer particles. The quality and efficiency of cutting directly affect the quality and production cost of chips. Semiconductor wafer dicing machine mainly includes grinding wheel dicing machine and laser dicing machine. Grinding wheel dicing machine is a precision numerical control equipment that integrates technologies such as water, gas, electricity, air static pressure high-speed spindle, precision mechanical transmission, sensors and automatic control. It is characterized by low cutting cost and high efficiency, and is suitable for cutting thicker wafers. The laser scribing machine uses a high-energy laser beam to irradiate the surface of the workpiece, so that the irradiated area is partially melted and vaporized, so as to achieve the purpose of scribing. It is characterized by high cutting precision and fast cutting speed, and is suitable for cutting thinner wafers.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.50% year-on-year.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Wafer Dicing Machine Industry Forecast” looks at past sales and reviews total world Semiconductor Wafer Dicing Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Wafer Dicing Machine sales for 2025 through 2031. With Semiconductor Wafer Dicing Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Wafer Dicing Machine industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Wafer Dicing Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Wafer Dicing Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Wafer Dicing Machine market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Wafer Dicing Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Wafer Dicing Machine.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Wafer Dicing Machine market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Grinding Wheel Dicing Machine
Laser Scribing Machine

Segmentation by Application:
Silicon Wafer
Ceramics
Glass
Optoelectronic Components
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
DISCO Corporation
ACCRETECH
ASM
Synova
Genesem
Advanced Dicing Technologies (ADT)
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd
Zhuhai Bojay Electronics Co., Ltd
GL TECH CO., LTD
Shenyang Heyan Technology Co., Ltd
Wuhan Sunic Photoelectricity Equipment Manufacture Co., Ltd
ZHENGZHOU QISHENG PRECISION MANUFACTURING CO.,LTD

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Wafer Dicing Machine market?

What factors are driving Semiconductor Wafer Dicing Machine market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Wafer Dicing Machine market opportunities vary by end market size?

How does Semiconductor Wafer Dicing Machine break out by Type, by Application?

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