Global Semiconductor Wafer Defect Inspection Equipment Market Growth 2025-2031

The global Semiconductor Wafer Defect Inspection Equipment market size is predicted to grow from US$ 7494 million in 2025 to US$ 13250 million in 2031; it is expected to grow at a CAGR of 10.0% from 2025 to 2031.

Semiconductor inspection runs through the entire semiconductor process, that is, the front-end and back-end. Semiconductor inspection includes optical inspection, electron beam inspection and X-ray measurement. It mainly detects whether there are abnormal quality conditions on the surface of the wafer or in the circuit structure, such as scratches, particle contamination, graphic errors and other defects. Different inspection technologies have obvious differences, mainly reflected in accuracy, speed and inspection purposes.

Semiconductor inspection types include patterned, non-patterned and mask inspection. Among them, patterned defect inspection is divided into bright field and dark field inspection. Both are analyzed through optical signals. The difference is that the bright field is a vertically reflected light signal, while the dark field is a scattered light signal.

Semiconductor optical inspection mainly refers to automatic optical inspection (AOI), which is a key technology with a wide range of uses in wafer manufacturing. Optical inspection is non-contact and has minimal destructiveness to the wafer itself; by performing batch and rapid inspection of wafers, it can meet the manufacturer's requirements for throughput. Optical profilers are also a type of optical inspection equipment, but they are significantly different from AOI equipment. The statistical scope of this article does not include optical profilers. Automatic optical inspection (AOI) is a detection method that obtains the image of the object under test through optical imaging, processes and analyzes it through a specific algorithm, and compares it with the standard template image to obtain the defects of the object under test. As the wafer size gradually shifts to 12 inches, the speed and accuracy of wafer defect detection are becoming more and more important. By replacing manual scratches and other appearance inspections with AOI systems, the speed and quality of wafer output can be improved, thereby reducing the output of scrapped products and reducing labor costs.

This article focuses on the statistics of equipment used for wafer defect inspection, such as patterned wafer defect inspection, non-patterned wafer defect inspection, electron beam wafer defect inspection and X-ray wafer defect inspection.

The global key manufacturers of Wafer Defect Inspection System include KLA Corporation, Applied Materials, ASML, Hitachi High-Tech Corporation, Onto Innovation, Camtek, Skyverse Technology, SCREEN Semiconductor Solutions, Lasertec, NEXTIN, etc. In 2023, the global top 10 players had a share approximately 92.0% in terms of revenue.

In Patterned Wafer Defect Inspection Systems segment are dominated by KLA and Applied Materials;

Unpatterned Wafer Inspection Systems are dominated by KLA and Hitachi High-Tech Corporation; e-Beam Wafer Defect Review and Classification Systems are dominated by ASML and Applied Materials.

The global market for semiconductor was estimated at US$ 526.8 billion in the year 2023, is projected to US$ 780.7 billion by 2030. IC Manufacturing is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM). According to our research, the global semiconductor manufacturing (wafer fabrication) market is projected to grow from US$ 251.7 billion in 2023 to US$ 506.5 billion by 2030, at a Compound Annual Growth Rate (CAGR) of 40.49% during the forecast period. This will drive rapid growth of global Wafer Defect Inspection System.

LP Information, Inc. (LPI) ' newest research report, the “Semiconductor Wafer Defect Inspection Equipment Industry Forecast” looks at past sales and reviews total world Semiconductor Wafer Defect Inspection Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Wafer Defect Inspection Equipment sales for 2025 through 2031. With Semiconductor Wafer Defect Inspection Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Wafer Defect Inspection Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Wafer Defect Inspection Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Wafer Defect Inspection Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Semiconductor Wafer Defect Inspection Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Wafer Defect Inspection Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Wafer Defect Inspection Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Wafer Defect Inspection Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

Patterned Wafer Defect Inspection System

Non-patterned Wafer Defect Inspection System

E-beam Wafer Defect Inspection and Classification System

Wafer Macro Defects Detection and Classification

Wafer Inspection System for Advanced Packaging

Segmentation by Application:

300mm Wafer Size

200mm Wafer Size

Others

This report also splits the market by region:

Americas

United States

Canada

Mexico

Brazil

APAC

China

Japan

Korea

Southeast Asia

India

Australia

Europe

Germany

France

UK

Italy

Russia

Middle East & Africa

Egypt

South Africa

Israel

Turkey

GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

KLA Corporation

Applied Materials

Lasertec

Hitachi High-Tech Corporation

ASML

Onto Innovation

Camtek

SCREEN Semiconductor Solutions

Skyverse Technology

Toray Engineering

NEXTIN

Suzhou TZTEK (Muetec)

Microtronic

Bruker

SMEE

Hangzhou Changchuan Technology

Wuhan Jingce Electronic Group

Angkun Vision (Beijing) Technology

Nanotronics

Visiontec Group

Hefei Yuwei Semiconductor Technology

Suzhou Secote (Optima)

DJEL

Jiangsu VPTEK

Ever Red New Technology

Confovis

Zhongdao Optoelectronic

Suzhou Xinshi Technology

RSIC scientific instrument (Shanghai)

Gaoshi Technology (Suzhou)

Unity Semiconductor SAS

JUTZE Intelligence Technology

Chroma ATE Inc

CMIT

Engitist Corporation

HYE Technology

Shuztung Group

Cortex Robotics

Takano

Shanghai Techsense

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Wafer Defect Inspection Equipment market?

What factors are driving Semiconductor Wafer Defect Inspection Equipment market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do Semiconductor Wafer Defect Inspection Equipment market opportunities vary by end market size?

How does Semiconductor Wafer Defect Inspection Equipment break out by Type, by Application?

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